Understanding tip-enhanced Raman spectroscopy by multiphysics finite element simulations

Vladimir Kolchuzhin, Jan Mehner, Evgeniya Sheremet, Bhattacharya Kunal, Raul D. Rodriguez, Dietrich R.T. Zahn

Результат исследований: Материалы для книги/типы отчетовМатериалы для конференции

3 Цитирования (Scopus)

Аннотация

This article deals with the models development and FE simulations for mechanical properties of all-metal AFM-TERS tips and electric field enhancement between the tip and the sample. The most important aspects in simulations, the parameters necessary in creating models, and the obtained results are presented and discussed in the article.

Язык оригиналаАнглийский
Название основной публикации2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015
ИздательInstitute of Electrical and Electronics Engineers Inc.
ISBN (электронное издание)9781479999507
DOI
СостояниеОпубликовано - 6 мая 2015
Опубликовано для внешнего пользованияДа
Событие2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 - Budapest, Венгрия
Продолжительность: 19 апр 201522 апр 2015

Конференция

Конференция2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015
СтранаВенгрия
ГородBudapest
Период19.4.1522.4.15

ASJC Scopus subject areas

  • Computational Theory and Mathematics
  • Electrical and Electronic Engineering
  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering

Fingerprint Подробные сведения о темах исследования «Understanding tip-enhanced Raman spectroscopy by multiphysics finite element simulations». Вместе они формируют уникальный семантический отпечаток (fingerprint).

  • Цитировать

    Kolchuzhin, V., Mehner, J., Sheremet, E., Kunal, B., Rodriguez, R. D., & Zahn, D. R. T. (2015). Understanding tip-enhanced Raman spectroscopy by multiphysics finite element simulations. В 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 [7103161] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EuroSimE.2015.7103161