Thermoelectric cooling for bare dies power devices embedded in pcb substrates

Shuangfeng Zhang, Eric Laboure, Denis Labrousselabrousse, Stéphane Lefebvre

Результат исследований: Материалы для книги/типы отчетовМатериалы для конференции

Аннотация

Efficient thermal solutions are becoming a challenging issue in integrated power boards based on PCB substrate in which bare dies can be embedded. The purpose of this paper is to study and compare different solutions based on thermal vias, thick PCB copper layers and thermoelectric coolers (TECs). For TEC, multiphysics 3D simulations using Finite Element Method (FEM) are performed to define their optimum parameters leading to the maximum coefficient of performance (COP). Experiments have been performed to validate the 3D thermal models. These experiments are based on a test-bench providing thermal heat flux measurement in order to compare thermal performances of the different cooling solutions.

Язык оригиналаАнглийский
Название основной публикацииPCIM Europe Conference Proceedings
РедакторыAchim Scharf
ИздательMesago PCIM GmbH
Страницы1408-1415
Число страниц8
Издание225809
ISBN (печатное издание)9783800746460
СостояниеОпубликовано - 1 янв 2018
Опубликовано для внешнего пользованияДа
СобытиеInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018 - Nuremberg, Германия
Продолжительность: 5 июн 20187 июн 2018

Серия публикаций

НазваниеPCIM Europe Conference Proceedings
Номер225809
ISSN (электронное издание)2191-3358

Конференция

КонференцияInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018
СтранаГермания
ГородNuremberg
Период5.6.187.6.18

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Fingerprint Подробные сведения о темах исследования «Thermoelectric cooling for bare dies power devices embedded in pcb substrates». Вместе они формируют уникальный семантический отпечаток (fingerprint).

  • Цитировать

    Zhang, S., Laboure, E., Labrousselabrousse, D., & Lefebvre, S. (2018). Thermoelectric cooling for bare dies power devices embedded in pcb substrates. В A. Scharf (Ред.), PCIM Europe Conference Proceedings (225809 ред., стр. 1408-1415). (PCIM Europe Conference Proceedings; № 225809). Mesago PCIM GmbH.