Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices

Аннотация

The crack and delamination of solder joints between base plates and DCB substrates of power modules is one of the most frequently encountered failure mode and studied in literature. In this paper we present numerical effects of solder meniscus design in solder lifetime prediction. Especially, we show the effect of singular points, which appear in the border edges or comers of DCB or solder joints geometries, in mechanical stress, strain and plastic work evaluations. Furthermore the effect of mesh density on mechanical stress and strains is Shown. Finally, we will see the effect of the meniscus design of the solder joint on lifetime estimation using both plastic strain-based and energy-based models.

Язык оригинала	Английский
Название основной публикации	EuroSime 2007
Подзаголовок основной публикации	International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007
DOI	https://doi.org/10.1109/ESIME.2007.360017
Состояние	Опубликовано - 27 ноя 2007
Опубликовано для внешнего пользования	Да
Событие	EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007 - London, Великобритания Продолжительность: 16 апр 2007 → 18 апр 2007

Серия публикаций

Название	EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007

Конференция

Конференция	EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007
Страна	Великобритания
Город	London
Период	16.4.07 → 18.4.07

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Surfaces, Coatings and Films
Condensed Matter Physics

Доступ к документу

10.1109/ESIME.2007.360017

Fingerprint Подробные сведения о темах исследования «Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices». Вместе они формируют уникальный семантический отпечаток (fingerprint).

Цитировать

Bouarroudj, M., Khatir, Z., Lefebvre, S., & Dupont, L. (2007). Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices. В EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007 [4201184] (EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007). https://doi.org/10.1109/ESIME.2007.360017

Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices. / Bouarroudj, M.; Khatir, Z.; Lefebvre, S.; Dupont, L.

EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. 2007. 4201184 (EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007).

Результат исследований: Материалы для книги/типы отчетов › Материалы для конференции

Bouarroudj, M, Khatir, Z, Lefebvre, S & Dupont, L 2007, Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices. в EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007., 4201184, EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007, EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007, London, Великобритания, 16.4.07. https://doi.org/10.1109/ESIME.2007.360017

Bouarroudj M, Khatir Z, Lefebvre S, Dupont L. Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices. В EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. 2007. 4201184. (EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007). https://doi.org/10.1109/ESIME.2007.360017

Bouarroudj, M. ; Khatir, Z. ; Lefebvre, S. ; Dupont, L. / Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices. EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. 2007. (EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007).

@inproceedings{9a1bae70066d48918dcfaa490bdde19b,

title = "Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices",

abstract = "The crack and delamination of solder joints between base plates and DCB substrates of power modules is one of the most frequently encountered failure mode and studied in literature. In this paper we present numerical effects of solder meniscus design in solder lifetime prediction. Especially, we show the effect of singular points, which appear in the border edges or comers of DCB or solder joints geometries, in mechanical stress, strain and plastic work evaluations. Furthermore the effect of mesh density on mechanical stress and strains is Shown. Finally, we will see the effect of the meniscus design of the solder joint on lifetime estimation using both plastic strain-based and energy-based models.",

author = "M. Bouarroudj and Z. Khatir and S. Lefebvre and L. Dupont",

year = "2007",

month = nov,

day = "27",

doi = "10.1109/ESIME.2007.360017",

language = "English",

isbn = "1424411068",

series = "EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007",

booktitle = "EuroSime 2007",

note = "EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007 ; Conference date: 16-04-2007 Through 18-04-2007",

}

TY - GEN

T1 - Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices

AU - Bouarroudj, M.

AU - Khatir, Z.

AU - Lefebvre, S.

AU - Dupont, L.

PY - 2007/11/27

Y1 - 2007/11/27

N2 - The crack and delamination of solder joints between base plates and DCB substrates of power modules is one of the most frequently encountered failure mode and studied in literature. In this paper we present numerical effects of solder meniscus design in solder lifetime prediction. Especially, we show the effect of singular points, which appear in the border edges or comers of DCB or solder joints geometries, in mechanical stress, strain and plastic work evaluations. Furthermore the effect of mesh density on mechanical stress and strains is Shown. Finally, we will see the effect of the meniscus design of the solder joint on lifetime estimation using both plastic strain-based and energy-based models.

AB - The crack and delamination of solder joints between base plates and DCB substrates of power modules is one of the most frequently encountered failure mode and studied in literature. In this paper we present numerical effects of solder meniscus design in solder lifetime prediction. Especially, we show the effect of singular points, which appear in the border edges or comers of DCB or solder joints geometries, in mechanical stress, strain and plastic work evaluations. Furthermore the effect of mesh density on mechanical stress and strains is Shown. Finally, we will see the effect of the meniscus design of the solder joint on lifetime estimation using both plastic strain-based and energy-based models.

UR - http://www.scopus.com/inward/record.url?scp=36349002345&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=36349002345&partnerID=8YFLogxK

U2 - 10.1109/ESIME.2007.360017

DO - 10.1109/ESIME.2007.360017

M3 - Conference contribution

AN - SCOPUS:36349002345

SN - 1424411068

SN - 9781424411061

T3 - EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007

BT - EuroSime 2007

T2 - EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007

Y2 - 16 April 2007 through 18 April 2007

ER -