Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices

M. Bouarroudj, Z. Khatir, S. Lefebvre, L. Dupont

Результат исследований: Материалы для книги/типы отчетовМатериалы для конференции

6 Цитирования (Scopus)

Аннотация

The crack and delamination of solder joints between base plates and DCB substrates of power modules is one of the most frequently encountered failure mode and studied in literature. In this paper we present numerical effects of solder meniscus design in solder lifetime prediction. Especially, we show the effect of singular points, which appear in the border edges or comers of DCB or solder joints geometries, in mechanical stress, strain and plastic work evaluations. Furthermore the effect of mesh density on mechanical stress and strains is Shown. Finally, we will see the effect of the meniscus design of the solder joint on lifetime estimation using both plastic strain-based and energy-based models.

Язык оригиналаАнглийский
Название основной публикацииEuroSime 2007
Подзаголовок основной публикацииInternational Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007
DOI
СостояниеОпубликовано - 27 ноя 2007
Опубликовано для внешнего пользованияДа
СобытиеEuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007 - London, Великобритания
Продолжительность: 16 апр 200718 апр 2007

Серия публикаций

НазваниеEuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007

Конференция

КонференцияEuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007
СтранаВеликобритания
ГородLondon
Период16.4.0718.4.07

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Condensed Matter Physics

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  • Цитировать

    Bouarroudj, M., Khatir, Z., Lefebvre, S., & Dupont, L. (2007). Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices. В EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007 [4201184] (EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007). https://doi.org/10.1109/ESIME.2007.360017