TY - GEN
T1 - Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices
AU - Bouarroudj, M.
AU - Khatir, Z.
AU - Lefebvre, S.
AU - Dupont, L.
PY - 2007/11/27
Y1 - 2007/11/27
N2 - The crack and delamination of solder joints between base plates and DCB substrates of power modules is one of the most frequently encountered failure mode and studied in literature. In this paper we present numerical effects of solder meniscus design in solder lifetime prediction. Especially, we show the effect of singular points, which appear in the border edges or comers of DCB or solder joints geometries, in mechanical stress, strain and plastic work evaluations. Furthermore the effect of mesh density on mechanical stress and strains is Shown. Finally, we will see the effect of the meniscus design of the solder joint on lifetime estimation using both plastic strain-based and energy-based models.
AB - The crack and delamination of solder joints between base plates and DCB substrates of power modules is one of the most frequently encountered failure mode and studied in literature. In this paper we present numerical effects of solder meniscus design in solder lifetime prediction. Especially, we show the effect of singular points, which appear in the border edges or comers of DCB or solder joints geometries, in mechanical stress, strain and plastic work evaluations. Furthermore the effect of mesh density on mechanical stress and strains is Shown. Finally, we will see the effect of the meniscus design of the solder joint on lifetime estimation using both plastic strain-based and energy-based models.
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U2 - 10.1109/ESIME.2007.360017
DO - 10.1109/ESIME.2007.360017
M3 - Conference contribution
AN - SCOPUS:36349002345
SN - 1424411068
SN - 9781424411061
T3 - EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007
BT - EuroSime 2007
T2 - EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007
Y2 - 16 April 2007 through 18 April 2007
ER -