Thermal management for GaN power devices mounted on PCB substrates

Shuangfeng Zhang, Eric Laboure, Denis Labrousse, Stephane Lefebvre

Результат исследований: Материалы для книги/типы отчетовМатериалы для конференции

8 Цитирования (Scopus)

Аннотация

This paper investigates different thermal management solutions for GaN HEMT mounted on Printed Circuit Board (PCB) substrates. Wide bandgap (WBG) power semiconductors like GaN devices have the ability to operate at high switching-frequency (from few 100 kHz to several MHz). To take advantage of their high frequency switching capabilities, the parasitic inductances of power connections as well as the connections between the dies and the gate driver must be minimized. So the majority of GaN chips available on the market are packaged so that they can be directly attached to a PCB. The embedding technology of GaN dies in PCB substrate is attractive because it offers various interconnection possibilities. However, the low thermal conductivity of glass epoxy will result in high thermal resistance of the substrate. So it is of the first importance to seek technological means in order to improve the cooling of GaN chips soldered or embedded in such PCB structures.

Язык оригиналаАнглийский
Название основной публикации2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017
ИздательInstitute of Electrical and Electronics Engineers Inc.
ISBN (электронное издание)9781509042784
DOI
СостояниеОпубликовано - 31 мая 2017
Опубликовано для внешнего пользованияДа
Событие2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017 - Delft, Нидерланды
Продолжительность: 5 апр 20177 апр 2017

Серия публикаций

Название2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017

Конференция

Конференция2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017
СтранаНидерланды
ГородDelft
Период5.4.177.4.17

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Polymers and Plastics

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  • Цитировать

    Zhang, S., Laboure, E., Labrousse, D., & Lefebvre, S. (2017). Thermal management for GaN power devices mounted on PCB substrates. В 2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017 [7936752] (2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IWIPP.2017.7936752