The peculiarities of modeling reliability parameters for printed circuit assembly electronics working in cycling mode

Результат исследований: Материалы для журналаСтатья

9 Цитирования (Scopus)

Выдержка

Temperature fields of typical printed circuit assembly electronics working in cycling mode were numerically analyzed taking into account convection and radiation heat transfer with the external environment. The data obtained show the necessary to use real temperature values in the problems of defining the reliability parameters of the device working in cycling mode with Jong intervals of interruption.

Язык оригиналаАнглийский
Страницы (с-по)19-22
Число страниц4
ЖурналElektromagnitnye Volny i Elektronnye Systemy
Том10
Номер выпуска11-12
СостояниеОпубликовано - 2005

Отпечаток

Heat convection
Printed circuits
Heat radiation
printed circuits
Temperature distribution
Electronic equipment
assembly
cycles
interruption
electronics
temperature distribution
convection
heat transfer
intervals
Temperature
radiation
temperature

ASJC Scopus subject areas

  • Radiation
  • Electrical and Electronic Engineering

Цитировать

The peculiarities of modeling reliability parameters for printed circuit assembly electronics working in cycling mode. / Kuznetsov, G. V.; Kravchenko, Evgeniy Vladimirovich.

В: Elektromagnitnye Volny i Elektronnye Systemy, Том 10, № 11-12, 2005, стр. 19-22.

Результат исследований: Материалы для журналаСтатья

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