Выдержка

Polycrystalline diamond films were fabricated on copper substrates by a multi-step process comprised of physical vapor deposition of Al-based composite interlayer on Cu substrate and depositing continuous diamond film on composite interlayer by plasma assisted chemical vapor deposition (PACVD). The interface characteristics and adhesion strength were investigated by Auger electron spectroscopy, Raman analysis, calotest and indentation test. The results show that the continuous film without cracks is successfully obtained. The improved adhesion between diamond film and substrate results from the low residual stress in the film due to their compensation by Al interlayer in the sample cooling process.

Язык оригиналаАнглийский
Номер статьи012102
ЖурналJournal of Physics: Conference Series
Том830
Номер выпуска1
DOI
СостояниеОпубликовано - 4 мая 2017

Отпечаток

diamond films
interlayers
adhesion
vapor deposition
copper
composite materials
indentation
Auger spectroscopy
residual stress
electron spectroscopy
cracks
cooling

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Цитировать

The dynamic sublayers for improving the adhesion of CVD diamond films on copper. / Gaydaychuk, A. V.; Linnik, S. A.; Okhotnikov, V. V.

В: Journal of Physics: Conference Series, Том 830, № 1, 012102, 04.05.2017.

Результат исследований: Материалы для журналаСтатья

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AB - Polycrystalline diamond films were fabricated on copper substrates by a multi-step process comprised of physical vapor deposition of Al-based composite interlayer on Cu substrate and depositing continuous diamond film on composite interlayer by plasma assisted chemical vapor deposition (PACVD). The interface characteristics and adhesion strength were investigated by Auger electron spectroscopy, Raman analysis, calotest and indentation test. The results show that the continuous film without cracks is successfully obtained. The improved adhesion between diamond film and substrate results from the low residual stress in the film due to their compensation by Al interlayer in the sample cooling process.

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