Tangential cathode magnetic field and substrate bias influence on copper vacuum arc macroparticle content decreasing

Результат исследований: Материалы для журналаСтатья

6 Цитирования (Scopus)


The paper presents the results of an experimental study of accumulation of copper macroparticles (MP) on a negatively biased substrate immersed in DC vacuum arc plasma. The influence of normal and tangential magnetic fields and high-frequency short-pulsed negative bias was investigated. The joint application of a tangential magnetic field and high frequency short-pulsed negative bias provides an effect of MP multifold suppression. With a tangential magnetic field strength of 175 Gs and repetitively pulsed bias (7 μs, 105 p.p.s., − 2 kV), total suppression efficiency is 250-fold after 6 min of ion-plasma treatment. For macroparticles with the diameter of less or > 1 μm, the efficiency is 3000-fold or 70-fold, respectively. In comparison with an axisymmetric vacuum-arc plasma source, the application of a steered arc ensures a 10-fold reduction in MP density on a substrate immersed in copper vacuum-arc plasma. The possibility of ion implantation using low-energy high-frequency short-pulse plasma immersion by implementing DC vacuum arc plasma is discussed.

Язык оригиналаАнглийский
Страницы (с-по)21-24
Число страниц4
ЖурналSurface and Coatings Technology
СостояниеОпубликовано - 25 ноя 2016

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

Fingerprint Подробные сведения о темах исследования «Tangential cathode magnetic field and substrate bias influence on copper vacuum arc macroparticle content decreasing». Вместе они формируют уникальный семантический отпечаток (fingerprint).

  • Виды деятельности

    • 1 Участие в конференции

    International Conference on Surface Modification of Materials by Ion Beams

    Nurken Erbolatovich Aktaev (Участник) & Igor Borisovich Stepanov (Участник)

    23 ноя 201527 ноя 2015

    Деятельность: Участие в конференции