Structure and mechanical properties of DC magnetron sputtered TiC/Cu films

J. Soldán, J. Musil

Результат исследований: Материалы для журналаСтатья

36 Цитирования (Scopus)

Выдержка

TiC/Cu nanocomposite films with various copper content were deposited by DC unbalanced magnetron sputtering from sintered TiC target fixed by Cu rings of different inner diameters in pure argon. This makes it possible to prepare TiC/Cu films with Cu content ranging from approximately 5 to 85 at% Cu. The structure (XRD, Raman, SEM) and mechanical properties were examined as a function of deposition parameters and Cu content in the film. Special attention is devoted to the total internal stress, parameters determining its magnitude and their correlation with mechanical properties. The TiC/Cu system is compared with similar nitride MeNx/Cu(Ni) (Me=Ti, Zr) systems and an explanation of the different behavior of nitride and carbide systems is proposed.

Язык оригиналаАнглийский
Страницы (с-по)531-538
Число страниц8
ЖурналVacuum
Том81
Номер выпуска4
DOI
СостояниеОпубликовано - 6 ноя 2006

Отпечаток

Nitrides
direct current
mechanical properties
Mechanical properties
nitrides
Nanocomposite films
Argon
Magnetron sputtering
Carbides
Copper
Residual stresses
carbides
Scanning electron microscopy
residual stress
magnetron sputtering
nanocomposites
argon
copper
scanning electron microscopy
rings

ASJC Scopus subject areas

  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films

Цитировать

Structure and mechanical properties of DC magnetron sputtered TiC/Cu films. / Soldán, J.; Musil, J.

В: Vacuum, Том 81, № 4, 06.11.2006, стр. 531-538.

Результат исследований: Материалы для журналаСтатья

Soldán, J. ; Musil, J. / Structure and mechanical properties of DC magnetron sputtered TiC/Cu films. В: Vacuum. 2006 ; Том 81, № 4. стр. 531-538.
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