Regimes of water droplet evaporation on copper substrates

G. V. Kuznetsov, Dmitriy Vladimirovich Feoktistov, Evgenija Georgievna Orlova, K. A. Batishcheva

Результат исследований: Материалы для журналаСтатья

23 Цитирования (Scopus)

Выдержка

Distilled water droplet evaporation has been studied on copper substrate surfaces with different degrees of roughness. Data on variations in the contact diameter have been employed to distinguish between the regimes of distilled water droplet spreading over the copper surfaces that proceed after the viscous regime. For each isolated regime, the duration has been determined as a fraction of the total evaporation time and the main physical processes have been described. Variations in contact angles have been analyzed as depending on copper surface temperature. It has been established that, as the substrate temperature is elevated, wetting becomes better, while the adhesion work remains almost unchanged, thereby indicating the absence of chemical and structural transformations at the liquid–substrate interface.

Язык оригиналаАнглийский
Страницы (с-по)335-339
Число страниц5
ЖурналColloid Journal of the Russian Academy of Sciences: Kolloidnyi Zhurnal
Том78
Номер выпуска3
DOI
СостояниеОпубликовано - 1 мая 2016

Отпечаток

Copper
Evaporation
evaporation
copper
Water
Substrates
water
surface temperature
wetting
Contact angle
Wetting
adhesion
roughness
Adhesion
Surface roughness
Temperature
temperature

ASJC Scopus subject areas

  • Physical and Theoretical Chemistry
  • Colloid and Surface Chemistry
  • Surfaces and Interfaces

Цитировать

Regimes of water droplet evaporation on copper substrates. / Kuznetsov, G. V.; Feoktistov, Dmitriy Vladimirovich; Orlova, Evgenija Georgievna; Batishcheva, K. A.

В: Colloid Journal of the Russian Academy of Sciences: Kolloidnyi Zhurnal, Том 78, № 3, 01.05.2016, стр. 335-339.

Результат исследований: Материалы для журналаСтатья

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