Аннотация
For the development of lifetime models in a physics-of-failure approach for microelectronic devices and functional elements on the submicron or even nanoscopic scale, the exact knowledge of the materials in use and their failure behavior is imperative. A piezoresistive MEMS force sensor, which can be integrated in MEMS sized tensile and fatigue test stages, was developed and is characterized using micro-Raman spectroscopy. This paper describes the experimental approach, the implementation and results of micro-Raman stress measurements in comparison to numerical simulations based on the finite element method.
Язык оригинала | Английский |
---|---|
Название основной публикации | 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 |
Издатель | Institute of Electrical and Electronics Engineers Inc. |
ISBN (электронное издание) | 9781509021062 |
DOI | |
Состояние | Опубликовано - 29 апр 2016 |
Опубликовано для внешнего пользования | Да |
Событие | 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 - Montpellier, Франция Продолжительность: 18 апр 2016 → 20 апр 2016 |
Конференция
Конференция | 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 |
---|---|
Страна | Франция |
Город | Montpellier |
Период | 18.4.16 → 20.4.16 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering
- Surfaces, Coatings and Films
- Modelling and Simulation
- Safety, Risk, Reliability and Quality
- Industrial and Manufacturing Engineering