Raman based stress analysis of the active areas of a piezoresistive MEMS force sensor - Experimental setup, data processing, and comparison to numerically obtained results

P. Meszmer, K. Hiller, R. D. Rodriguez, E. Sheremet, D. R.T. Zahn, M. Hietschold, B. Wunderle

Результат исследований: Материалы для книги/типы отчетовМатериалы для конференции

1 Цитирования (Scopus)

Аннотация

For the development of lifetime models in a physics-of-failure approach for microelectronic devices and functional elements on the submicron or even nanoscopic scale, the exact knowledge of the materials in use and their failure behavior is imperative. A piezoresistive MEMS force sensor, which can be integrated in MEMS sized tensile and fatigue test stages, was developed and is characterized using micro-Raman spectroscopy. This paper describes the experimental approach, the implementation and results of micro-Raman stress measurements in comparison to numerical simulations based on the finite element method.

Язык оригиналаАнглийский
Название основной публикации2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016
ИздательInstitute of Electrical and Electronics Engineers Inc.
ISBN (электронное издание)9781509021062
DOI
СостояниеОпубликовано - 29 апр 2016
Опубликовано для внешнего пользованияДа
Событие17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 - Montpellier, Франция
Продолжительность: 18 апр 201620 апр 2016

Конференция

Конференция17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016
СтранаФранция
ГородMontpellier
Период18.4.1620.4.16

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Surfaces, Coatings and Films
  • Modelling and Simulation
  • Safety, Risk, Reliability and Quality
  • Industrial and Manufacturing Engineering

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