Выдержка
For the development of lifetime models in a physics-of-failure approach for microelectronic devices and functional elements on the submicron or even nanoscopic scale, the exact knowledge of the materials in use and their failure behavior is imperative. A piezoresistive MEMS force sensor, which can be integrated in MEMS sized tensile and fatigue test stages, was developed and is characterized using micro-Raman spectroscopy. This paper describes the experimental approach, the implementation and results of micro-Raman stress measurements in comparison to numerical simulations based on the finite element method.
| Язык оригинала | Английский |
|---|---|
| Название основной публикации | 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 |
| Издатель | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (электронное издание) | 9781509021062 |
| DOI | |
| Состояние | Опубликовано - 29 апр 2016 |
| Опубликовано для внешнего пользования | Да |
| Событие | 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 - Montpellier, Франция Продолжительность: 18 апр 2016 → 20 апр 2016 |
Конференция
| Конференция | 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 |
|---|---|
| Страна | Франция |
| Город | Montpellier |
| Период | 18.4.16 → 20.4.16 |
Отпечаток
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering
- Surfaces, Coatings and Films
- Modelling and Simulation
- Safety, Risk, Reliability and Quality
- Industrial and Manufacturing Engineering
Цитировать
Raman based stress analysis of the active areas of a piezoresistive MEMS force sensor - Experimental setup, data processing, and comparison to numerically obtained results. / Meszmer, P.; Hiller, K.; Rodriguez, R. D.; Sheremet, E.; Zahn, D. R.T.; Hietschold, M.; Wunderle, B.
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016. Institute of Electrical and Electronics Engineers Inc., 2016. 7463340.Результат исследований: Материалы для книги/типы отчетов › Материалы для конференции
}
TY - GEN
T1 - Raman based stress analysis of the active areas of a piezoresistive MEMS force sensor - Experimental setup, data processing, and comparison to numerically obtained results
AU - Meszmer, P.
AU - Hiller, K.
AU - Rodriguez, R. D.
AU - Sheremet, E.
AU - Zahn, D. R.T.
AU - Hietschold, M.
AU - Wunderle, B.
PY - 2016/4/29
Y1 - 2016/4/29
N2 - For the development of lifetime models in a physics-of-failure approach for microelectronic devices and functional elements on the submicron or even nanoscopic scale, the exact knowledge of the materials in use and their failure behavior is imperative. A piezoresistive MEMS force sensor, which can be integrated in MEMS sized tensile and fatigue test stages, was developed and is characterized using micro-Raman spectroscopy. This paper describes the experimental approach, the implementation and results of micro-Raman stress measurements in comparison to numerical simulations based on the finite element method.
AB - For the development of lifetime models in a physics-of-failure approach for microelectronic devices and functional elements on the submicron or even nanoscopic scale, the exact knowledge of the materials in use and their failure behavior is imperative. A piezoresistive MEMS force sensor, which can be integrated in MEMS sized tensile and fatigue test stages, was developed and is characterized using micro-Raman spectroscopy. This paper describes the experimental approach, the implementation and results of micro-Raman stress measurements in comparison to numerical simulations based on the finite element method.
UR - http://www.scopus.com/inward/record.url?scp=84974528097&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84974528097&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE.2016.7463340
DO - 10.1109/EuroSimE.2016.7463340
M3 - Conference contribution
AN - SCOPUS:84974528097
BT - 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016
PB - Institute of Electrical and Electronics Engineers Inc.
ER -