Plasma deposition of alternate TiN/ZrN multilayer hard coatings

M. Braic, V. Braic, M. Balaceanu, G. Pavelescu, A. Vladescu

Результат исследований: Материалы для журналаСтатья

15 Цитирования (Scopus)

Выдержка

Microchemical, microstructural, mechanical and tribe-logical characteristics of alternate TiN/ZrN multilayer coatings were investigated by energy-dispersive X-ray (EDX) spectroscopy, X-ray diffraction (XRD), microhardness and thickness measurements, adhesion and wear resistance tests. The coatings, with various bilayer periods and thicknesses of the individual layers, were deposited on Si and steel substrates by the cathodic arc technique. A comparison with TiN and ZrN monolayer properties was carried out.

Язык оригиналаАнглийский
Страницы (с-по)1399-1404
Число страниц6
ЖурналJournal of Optoelectronics and Advanced Materials
Том5
Номер выпуска5
СостояниеОпубликовано - 1 янв 2003
Опубликовано для внешнего пользованияДа

Отпечаток

Plasma deposition
Hard coatings
Multilayers
coatings
Coatings
Thickness measurement
Steel
wear resistance
Microhardness
microhardness
Wear resistance
Monolayers
adhesion
x rays
Adhesion
arcs
steels
X ray diffraction
Substrates
diffraction

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Цитировать

Plasma deposition of alternate TiN/ZrN multilayer hard coatings. / Braic, M.; Braic, V.; Balaceanu, M.; Pavelescu, G.; Vladescu, A.

В: Journal of Optoelectronics and Advanced Materials, Том 5, № 5, 01.01.2003, стр. 1399-1404.

Результат исследований: Материалы для журналаСтатья

Braic, M, Braic, V, Balaceanu, M, Pavelescu, G & Vladescu, A 2003, 'Plasma deposition of alternate TiN/ZrN multilayer hard coatings', Journal of Optoelectronics and Advanced Materials, том. 5, № 5, стр. 1399-1404.
Braic, M. ; Braic, V. ; Balaceanu, M. ; Pavelescu, G. ; Vladescu, A. / Plasma deposition of alternate TiN/ZrN multilayer hard coatings. В: Journal of Optoelectronics and Advanced Materials. 2003 ; Том 5, № 5. стр. 1399-1404.
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