Molecular dynamics investigation of behavior of grain boundaries under thermo-mechanical external impact

A. Yu Nikonov, A. I. Dmitriev, S. G. Psakhie

Результат исследований: Материалы для книги/типы отчетовМатериалы для конференции

Аннотация

Molecular dynamics simulation of behavior of grain boundaries in bicrystal under shear loading were carried out. A variety of metals was investigated. The possibility of movement of the grain boundary in a direction perpendicular to the applied load was shown. The dependencies of the velocity of grain boundaries on the sample temperature are analysed. Results obtained in this paper help to understand the features of development of plastic deformation in polycrystals under shear loading.

Язык оригиналаАнглийский
Название основной публикации19th European Conference on Fracture
Подзаголовок основной публикацииFracture Mechanics for Durability, Reliability and Safety, ECF 2012
ИздательEuropean Conference on Fracture, ECF
ISBN (печатное издание)978-5-905576-18-8
СостояниеОпубликовано - 1 янв 2012
Событие19th European Conference on Fracture: Fracture Mechanics for Durability, Reliability and Safety, ECF 2012 - Kazan, Российская Федерация
Продолжительность: 26 авг 201231 авг 2012

Конференция

Конференция19th European Conference on Fracture: Fracture Mechanics for Durability, Reliability and Safety, ECF 2012
СтранаРоссийская Федерация
ГородKazan
Период26.8.1231.8.12

ASJC Scopus subject areas

  • Safety, Risk, Reliability and Quality

Fingerprint Подробные сведения о темах исследования «Molecular dynamics investigation of behavior of grain boundaries under thermo-mechanical external impact». Вместе они формируют уникальный семантический отпечаток (fingerprint).

  • Цитировать

    Nikonov, A. Y., Dmitriev, A. I., & Psakhie, S. G. (2012). Molecular dynamics investigation of behavior of grain boundaries under thermo-mechanical external impact. В 19th European Conference on Fracture: Fracture Mechanics for Durability, Reliability and Safety, ECF 2012 European Conference on Fracture, ECF.