Microstructure and properties of the composite on the basis of copper and diamond

Результат исследований: Материалы для книги/типы отчетовМатериалы для конференции

2 Цитирования (Scopus)

Аннотация

The paper presents the experimental material on obtaining and researching of threedimensional composite heat-conducting copper-diamond materials in the system of spark plasma sintering. Earlier [1-5], it was established that in order to achieve the effect of the increased heat conductivity of a composite it is necessary to create the conditions hindering the movement of heat flux on the interface boundary. In this work we have attempted to obtain the material with heat conductivity higher than that of pure copper due to addition of diamond powder and synthesis of the composite in the system of spark plasma sintering. For comparison, we have considered copper and diamond compositions in the ratios of 50/50 and 40/60 correspondingly. The results of the heat conductivity analysis have not exceeded the indices of pure copper; however, according to SEM data, it has been found that at SPS-sintering local domains with enhanced adhesion form on the surfaces of diamonds.

Язык оригиналаАнглийский
Название основной публикацииKey Engineering Materials
ИздательTrans Tech Publications Ltd
Страницы607-610
Число страниц4
Том685
ISBN (печатное издание)9783038357087
DOI
СостояниеОпубликовано - 2016
Событие4th International Conference for Young Scientists High Technology: Research and Applications, HTRA 2015 - Tomsk, Российская Федерация
Продолжительность: 21 апр 201524 апр 2015

Серия публикаций

НазваниеKey Engineering Materials
Том685
ISSN (печатное издание)10139826

Конференция

Конференция4th International Conference for Young Scientists High Technology: Research and Applications, HTRA 2015
СтранаРоссийская Федерация
ГородTomsk
Период21.4.1524.4.15

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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  • Цитировать

    Ivashutenko, A. S., Martyushev, N. V., & Drozdov, Y. Y. (2016). Microstructure and properties of the composite on the basis of copper and diamond. В Key Engineering Materials (Том 685, стр. 607-610). (Key Engineering Materials; Том 685). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/KEM.685.607