Mechanical behavior and damage of tridimensional multilayered ceramics-tungsten power electronic substrates

Charlotte Robert, Sylvie Pommier, Stephane Lefebvre, Marion Ortali, Michel Massiot

Результат исследований: Материалы для книги/типы отчетовМатериалы для конференции

Аннотация

Since few years a 3D electric lines is developed. But new applications will be to expose this circuit to high variation of temperature and use them for electronic power. Circuits lines are made of tungsten and insulation in alumina. These materials have different behavior. That difference implies mechanics stress and stress singularities. Some stress concentration can fracture materials or interface between them. Alumina is a brittle material. We need to know his fracture behavior. A statistic model is already used: Weibull model. The idea is to break about hundred samples and to related the probabilities to break of alumina used in the circuit versus stress.

Язык оригиналаАнглийский
Название основной публикацииASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012
Страницы357-365
Число страниц9
DOI
СостояниеОпубликовано - 1 дек 2012
Опубликовано для внешнего пользованияДа
СобытиеASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012 - Nantes, Франция
Продолжительность: 2 июл 20124 июл 2012

Серия публикаций

НазваниеASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012
Том4

Конференция

КонференцияASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012
СтранаФранция
ГородNantes
Период2.7.124.7.12

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering

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    Robert, C., Pommier, S., Lefebvre, S., Ortali, M., & Massiot, M. (2012). Mechanical behavior and damage of tridimensional multilayered ceramics-tungsten power electronic substrates. В ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012 (стр. 357-365). (ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012; Том 4). https://doi.org/10.1115/ESDA2012-82305