Lower sintering temperature of nanostructured dense ceramics compacted from dry nanopowders using powerful ultrasonic action

O. Khasanov, U. Reichel, E. Dvilis, A. Khasanov

Результат исследований: Материалы для книги/типы отчетовМатериалы для конференции

5 Цитирования (Scopus)

Аннотация

Nanostructured high dense zirconia ceramics have been sintered from dry nanopowders compacted by uniaxial pressing with simultaneous powerful ultrasonic action (PUA). Powerful ultrasound with frequency of 21 kHz was supplied from ultrasonic generator to the mold, which was the ultrasonic wave-guide. Previously the mold was filled by non-agglomerated zirconia nanopowder having average particle size of 40 nm. Any binders or plasticizers were excluded at nanopowder processing. Compaction pressure was 240 MPa, power of ultrasonic generator at PUA was 1 kW and 3 kW. The fully dense zirconia ceramics has been sintered at 1345°C and high-dense ceramics with a density of 99.1%, the most grains of which had the sizes Dgr ≤ 200 nm, has been sintered at low sintering temperature (1325°C). Applied approach prevents essential grain growth owing to uniform packing of nanoparticles under vibrating PU-action at pressing, which provides the friction forces control during dry nanopowder compaction without contaminating binders or plasticizers.

Язык оригиналаАнглийский
Название основной публикацииIOP Conference Series: Materials Science and Engineering
ИздательInstitute of Physics Publishing
Том18
ИзданиеSYMPOSIUM 5
DOI
СостояниеОпубликовано - 2011
Событие3rd International Congress on Ceramics, ICC 2011 - Osaka, Япония
Продолжительность: 14 ноя 201018 ноя 2010

Другое

Другое3rd International Congress on Ceramics, ICC 2011
СтранаЯпония
ГородOsaka
Период14.11.1018.11.10

ASJC Scopus subject areas

  • Materials Science(all)
  • Engineering(all)

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  • Цитировать

    Khasanov, O., Reichel, U., Dvilis, E., & Khasanov, A. (2011). Lower sintering temperature of nanostructured dense ceramics compacted from dry nanopowders using powerful ultrasonic action. В IOP Conference Series: Materials Science and Engineering (SYMPOSIUM 5 ред., Том 18). [082004] Institute of Physics Publishing. https://doi.org/10.1088/1757-899X/18/8/082004