Low resistance Cu3Ge compounds formation by the low temperature treatment of Cu/Ge system in atomic hydrogen

A. I. Kazimirov, E. V. Erofeev, I. V. Fedin, V. A. Kagadei, Y. N. Yurjev

Результат исследований: Материалы для журналаСтатьярецензирование


The research deals with the regularities for Cu3Ge compound formation under the low temperature treatment of a double-layer Cu/Ge system deposited on i-GaAs substrate in atomic hydrogen flow. The treatment of a Cu/Ge/i-GaAs system with layer thicknesses, respectively, of 122 and 78 nm, in atomic hydrogen with a flow rate of 1015 at.cm-2s-1 for a duration of 2.5-10 min at room temperature, leads to an interdiffusion of Cu and Ge and formation of a polycrystalline film containing stoichiometric phase Cu3Ge. The film consists of vertically oriented grains of dimensions 100-150 nm and has a minimum specific resistance of 4.5 μΩ cm. Variation in the treatment duration of Cu/Ge/i-GaAs samples in atomic hydrogen affects Cu and Ge distribution profiles, the phase composition of films formed, and the specific resistance of the latter. As observed, Cu3Ge compound synthesis at room temperature demonstrates the stimulative effects characteristic of atomic hydrogen treatment for both Cu and Ge diffusion and for the chemical reaction of Cu3Ge compound generation. Activation of these processes can be conditioned by the energy released during recombination of hydrogen atoms adsorbed on the surface of a Cu/Ge/i-GaAs sample.

Язык оригиналаАнглийский
Номер статьи012016
ЖурналIOP Conference Series: Materials Science and Engineering
Номер выпуска1
СостояниеОпубликовано - 2 авг 2016
Событие8th International Scientific Conference on Issues of Physics and Technology in Science, Industry and Medicine - Tomsk, Российская Федерация
Продолжительность: 1 июн 20163 июн 2016

ASJC Scopus subject areas

  • Materials Science(all)
  • Engineering(all)

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