Inverse thermal model of temperature-to-power mapping for GaN systems

Shuangfeng Zhang, Eric Laboure, Denis Labrousse, Stéphane Lefebvre

Результат исследования: Материалы для книги/типы отчетовМатериалы для конференции

Аннотация

This paper deals with the problem of measurement of the losses in Power GaN chips due to almost impossibility to measure the current under the penalty of adding parasitic inductances incompatible with the switching speeds of these components. For this purpose, this paper investigates the steady-state inverse heat conduction model (IHCM) developed from thermal simulations. The main objective is to derive the power dissipation in a GaN chip mounted on or embedded in a PCB from the surface temperature measured by infrared thermography or thermal sensors. In this problem, the power devices losses are the solutions of the inverse problem of the temperature-to-power mapping. IHCM here is based on simple observations from real PCB structures with GaN chip embedded in PCB substrates. The error of the resultant power map with thermal noises is minimized by Least-Square Optimization, which transforms the direct inverse problem into a constrained optimization problem.

Язык оригиналаАнглийский
Заголовок главной публикацииPCIM Europe Conference Proceedings
РедакторыAchim Scharf
ИздательMesago PCIM GmbH
Страницы939-943
Количество страниц5
Редакция225809
ISBN (печатная версия)9783800746460
Статус публикацииОпубликовано - 1 янв 2018
Опубликовано для внешнего пользованияДа
СобытиеInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018 - Nuremberg, Германия
Длительность: 5 июн 20187 июн 2018

Серии публикаций

Имя, фамилияPCIM Europe Conference Proceedings
Номер225809
ISSN (электронная версия)2191-3358

Конференция

КонференцияInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018
СтранаГермания
ГородNuremberg
Период5.6.187.6.18

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Цитировать

Zhang, S., Laboure, E., Labrousse, D., & Lefebvre, S. (2018). Inverse thermal model of temperature-to-power mapping for GaN systems. В A. Scharf (Ред.), PCIM Europe Conference Proceedings (225809 ред., стр. 939-943). (PCIM Europe Conference Proceedings; № 225809). Mesago PCIM GmbH.