Influence of polymer aging on reliability indices of a typical printed-circuit assembly of radioelectronic equipment

Результат исследований: Материалы для журналаСтатья

9 Цитирования (Scopus)

Выдержка

Mathematical modeling of nonlinear nonstationary temperature fields of a typical printed-circuit assembly of radioelectronic equipment has been performed in a three-dimensional formulation with account for the convective and radiative heat exchange with the environment. On the basis of the data of the numerical experiment the "aging" (degradation) indices of polymer materials under prolonged thermal action have been determined. It has been established that the reliability of an object modeled with account for the real temperature fields is five times lower compared to the realization of normalized thermal conditions.

Язык оригиналаАнглийский
Страницы (с-по)1050-1054
Число страниц5
ЖурналJournal of Engineering Physics and Thermophysics
Том80
Номер выпуска5
DOI
СостояниеОпубликовано - сен 2007

Отпечаток

Printed circuits
Polymers
Aging of materials
Temperature distribution
Degradation
Hot Temperature
Experiments

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Mechanical Engineering

Цитировать

Influence of polymer aging on reliability indices of a typical printed-circuit assembly of radioelectronic equipment. / Kuznetsov, G. V.; Kravchenko, Evgeniy Vladimirovich.

В: Journal of Engineering Physics and Thermophysics, Том 80, № 5, 09.2007, стр. 1050-1054.

Результат исследований: Материалы для журналаСтатья

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