Heat transfer in cooling systems of microelectronic equipment with partially submerged condensers

Результат исследований: Материалы для журналаСтатьярецензирование

3 Цитирования (Scopus)

Аннотация

The heat transfer in a liquid immersion cooling system for microelectronic equipment was tested. The internal volume of the module was divided into two parts with a special partition. Inert dielectric liquid MD3F was used in the experiments as a working fluid. The proposed system can reduce the influence of noncondensable gas on heat transfer at the vapor space condenser. It was determined that the average heat transfer coefficient does not substantially decrease during the condensation of vapor on the partially submerged tubes; this is due to the effect of the surface-tension-driven pressure gradient which occurs in the film of the condensate.

Язык оригиналаАнглийский
Страницы (с-по)157-162
Число страниц6
ЖурналIEEE Transactions on Components Packaging and Manufacturing Technology Part A
Том19
Номер выпуска2
DOI
СостояниеОпубликовано - 1 июн 1996

ASJC Scopus subject areas

  • Engineering(all)

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