Evolution of the entropy of dislocation structures with strain in solid solutions of Cu-0.5at.% Al

Yuriy Abzaev, Lyudmila Trishkina, Svetlana Porobova, Anatoliy Klopotov, Victor Alexeevich Vlasov, Vladimir Klopotov

Результат исследований: Материалы для книги/типы отчетовМатериалы для конференции

Аннотация

The study on the evolution of the dislocation structure (DS) parameters with strain of solid solutions of Cu-0.5 at.% Al at different test temperatures has been carried out. It has been shown that in substructures with a disordered type of DS (disorder), the disordered mixtures with non-disoriented cells, as well as mixtures of non-disoriented and disoriented cellular structures, the entropy density increases with strain. It has been shown that formation of the cellular substructure corresponds to a diffuse kinetic phase transition of the 1-st kind in the DS. A jump-like decrease in entropy accompanying this phase transition is associated with the annihilation of dislocations in cellular walls and formation of excess dislocation density.

Язык оригиналаАнглийский
Название основной публикацииMultifunctional Materials
Подзаголовок основной публикацииDevelopment and Application
ИздательTrans Tech Publications Ltd
Страницы232-236
Число страниц5
ISBN (печатное издание)9783038357292
DOI
СостояниеОпубликовано - 1 янв 2016
Событие12th International Conference on Prospects of Fundamental Sciences Development, PFSD 2015 - Tomsk, Российская Федерация
Продолжительность: 21 апр 201524 апр 2015

Серия публикаций

НазваниеKey Engineering Materials
Том683
ISSN (печатное издание)1013-9826

Конференция

Конференция12th International Conference on Prospects of Fundamental Sciences Development, PFSD 2015
СтранаРоссийская Федерация
ГородTomsk
Период21.4.1524.4.15

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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  • Цитировать

    Abzaev, Y., Trishkina, L., Porobova, S., Klopotov, A., Vlasov, V. A., & Klopotov, V. (2016). Evolution of the entropy of dislocation structures with strain in solid solutions of Cu-0.5at.% Al. В Multifunctional Materials: Development and Application (стр. 232-236). (Key Engineering Materials; Том 683). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/KEM.683.232