Evaluation of substrate technologies under high temperature cycling

Laurent Dupont, Stéphane Lefebvre, Zoubir Khatir, Serge Bontemps

Результат исследований: Материалы для книги/типы отчетовМатериалы для конференции

10 Цитирования (Scopus)

Аннотация

This paper presents experimental results on the influence of different structures of ceramic substrates under very high temperature cycles. Test vehicles have been realised by APT Europe. Especially, DCB metallization thickness effects are pointed out in the ceramic fracture and solder delamination due to the high temperature variations. Special substrates, like DAB and Si3N4, are also investigated and compared to classical DCBs. Finally, the paper compares the different technologies under high temperature cycles, in order to identify the main factors that could increase the lifetime expectancy of power modules in such harsh environments.

Язык оригиналаАнглийский
Название основной публикации2006 4th International Conference on Integrated Power Systems, CIPS 2006
ИздательInstitute of Electrical and Electronics Engineers Inc.
ISBN (электронное издание)9783800729722
СостояниеОпубликовано - 1 янв 2006
Опубликовано для внешнего пользованияДа
Событие4th International Conference on Integrated Power Systems, CIPS 2006 - Naples, Италия
Продолжительность: 7 июн 20069 июн 2006

Серия публикаций

Название2006 4th International Conference on Integrated Power Systems, CIPS 2006

Конференция

Конференция4th International Conference on Integrated Power Systems, CIPS 2006
СтранаИталия
ГородNaples
Период7.6.069.6.06

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Energy Engineering and Power Technology
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

Fingerprint Подробные сведения о темах исследования «Evaluation of substrate technologies under high temperature cycling». Вместе они формируют уникальный семантический отпечаток (fingerprint).

  • Цитировать

    Dupont, L., Lefebvre, S., Khatir, Z., & Bontemps, S. (2006). Evaluation of substrate technologies under high temperature cycling. В 2006 4th International Conference on Integrated Power Systems, CIPS 2006 [5758029] (2006 4th International Conference on Integrated Power Systems, CIPS 2006). Institute of Electrical and Electronics Engineers Inc..