Electron-ion-plasma doping of aluminum surface with copper and titanium - A comparative analysis of the formed structure and properties

Yurii Ivanov, Anatolii Klopotov, Alexandr Potekaev, Olga Krysina, Pavel Moskvin, Elizaveta Petrikova, Olga Ivanova, Nikolaii Tsvetkov, Oleg Tolkachev

Результат исследований: Материалы для книги/типы отчетовМатериалы для конференции

Аннотация

Deposition of a titanium or a copper film onto the surface of commercially pure A7 aluminum and irradiation of the “film/substrate” system with an intense pulsed electron beam are carried out in a single vacuum cycle. Formation of a surface doped layer with a thickness of (20-30) μm is revealed. It is shown that the modified layer has a multiphase structure of a cellular rapid solidification of the submicron- nanosized range. Irradiation parameters are determined. It is established that the developed modification method allows forming a surface doped layer with the microhardness more than 4 times (Ti-Al alloy) or more than 3 times (Cu-Al alloy) greater than the microhardness of A7 aluminum; the wear resistance of the surface alloy Ti-Al exceeds the wear resistance of the initial aluminum in ≈2.4 times; doping of aluminum with copper is accompanied with an increase in the wear resistance of the material in ≈1.5 times.

Язык оригиналаАнглийский
Название основной публикацииRadiation-Thermal Effects and Processes in Inorganic Materials
РедакторыSergey Gyngazov
ИздательTrans Tech Publications Ltd
Страницы76-81
Число страниц6
ISBN (печатное издание)9783035714500
DOI
СостояниеОпубликовано - 1 янв 2018
Событие13th International Conference on Radiation-Thermal Effects and Processes in Inorganic Materials, RTEP 2017 - Tomsk, Российская Федерация
Продолжительность: 9 окт 201714 окт 2017

Серия публикаций

НазваниеKey Engineering Materials
Том781 KEM
ISSN (печатное издание)1013-9826

Конференция

Конференция13th International Conference on Radiation-Thermal Effects and Processes in Inorganic Materials, RTEP 2017
СтранаРоссийская Федерация
ГородTomsk
Период9.10.1714.10.17

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint Подробные сведения о темах исследования «Electron-ion-plasma doping of aluminum surface with copper and titanium - A comparative analysis of the formed structure and properties». Вместе они формируют уникальный семантический отпечаток (fingerprint).

  • Цитировать

    Ivanov, Y., Klopotov, A., Potekaev, A., Krysina, O., Moskvin, P., Petrikova, E., Ivanova, O., Tsvetkov, N., & Tolkachev, O. (2018). Electron-ion-plasma doping of aluminum surface with copper and titanium - A comparative analysis of the formed structure and properties. В S. Gyngazov (Ред.), Radiation-Thermal Effects and Processes in Inorganic Materials (стр. 76-81). (Key Engineering Materials; Том 781 KEM). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/KEM.781.76