Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling

L. Dupont, Z. Khatir, S. Lefebvre, S. Bontemps

Результат исследований: Материалы для журналаСтатьярецензирование

87 Цитирования (Scopus)

Аннотация

This study focuses on the influence of metallization thickness of ceramic substrates on reliability and lifetime of electronic power assemblies under high temperature cycling. The paper presents experimental and numerical results on different test vehicles with a number of DCB substrates with AlN ceramic and different copper thicknesses. It will be shown the influence of the DCB metallization on failure modes such as ceramic fracture and solder delamination under high temperature cycles. Finally, these samples will be compared with DCB substrates equipped with dimples and DAB substrates. Furthermore, the main factors that could increase the lifetime expectancy of power modules in such harsh environments will be identified.

Язык оригиналаАнглийский
Страницы (с-по)1766-1771
Число страниц6
ЖурналMicroelectronics Reliability
Том46
Номер выпуска9-11
DOI
СостояниеОпубликовано - 1 сен 2006
Опубликовано для внешнего пользованияДа

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Fingerprint Подробные сведения о темах исследования «Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling». Вместе они формируют уникальный семантический отпечаток (fingerprint).

Цитировать