Аннотация
The paper presents a high-rate method for metal coating deposition by the means of magnetron sputtering system (MSS) with liquid-phase target. Maximum copper deposition rate at a power density of 55 W/cm2 is 200 nm/s, which is twenty times higher than if an ordinary magnetron is used. The effect of material of the crucible on operation of MSS with liquid-phase target and copper coating deposition rate is studied. It is demonstrated that using the crucible with a lower emissivity allows the several-fold increase in deposition rate.
Язык оригинала | Английский |
---|---|
Страницы (с-по) | 135-138 |
Число страниц | 4 |
Журнал | Vacuum |
Том | 141 |
DOI | |
Состояние | Опубликовано - 1 июл 2017 |
ASJC Scopus subject areas
- Instrumentation
- Condensed Matter Physics
- Surfaces, Coatings and Films