Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules

M. Bouarroudj, Z. Khatir, J. P. Ousten, L. Dupont, S. Lefebvre, F. Badel

Результат исследований: Материалы для книги/типы отчетовМатериалы для конференции

13 Цитирования (Scopus)

Аннотация

The paper presents experimental investigations on both power and thermal cycling conditions on 600V-200A six-pack IGBT power modules. Both types of cycles are compared in term of thermomechanical stresses by using Finite Element simulations. Finally, combined stresses are simulated in order to assess the real conditions of use of these devices in automotive applications.

Язык оригиналаАнглийский
Название основной публикации2007 European Conference on Power Electronics and Applications, EPE
DOI
СостояниеОпубликовано - 1 дек 2007
Опубликовано для внешнего пользованияДа
Событие2007 European Conference on Power Electronics and Applications, EPE - Aalborg, Дания
Продолжительность: 2 сен 20075 сен 2007

Серия публикаций

Название2007 European Conference on Power Electronics and Applications, EPE

Конференция

Конференция2007 European Conference on Power Electronics and Applications, EPE
СтранаДания
ГородAalborg
Период2.9.075.9.07

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ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

Цитировать

Bouarroudj, M., Khatir, Z., Ousten, J. P., Dupont, L., Lefebvre, S., & Badel, F. (2007). Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules. В 2007 European Conference on Power Electronics and Applications, EPE [4417457] (2007 European Conference on Power Electronics and Applications, EPE). https://doi.org/10.1109/EPE.2007.4417457