Characterization of high-power pulsed dc magnetron discharges for ionized high-rate sputtering of copper films

J. Vlcek, A. D. Pajdarova, P. Belsky, J. Lukas, P. Kudlacek, J. Musil

Результат исследований: Материалы для журнала

4 Цитирования (Scopus)

Аннотация

A systematic time-resolved plasma diagnostics was carried out in high-power pulsed dc magnetron discharges used for ionized high-rate sputtering of high-quality, highly conductive copper films. The deposition rate of Cu films formed on a grounded substrate at the distance of 100mm from the target was higher than 2μm/min (averaged over a total deposition time) for an average target power loading in a pulse Pda=700W/cm2 (calculated for a total area of the target) at a repetition frequency f = lkHz, a 20% duty cycle and argon pressures p=0.1 and 1 Pa. The flux of sputtered Cu atoms was highly ionized with a strong predominance of Cu+ ions (80-95% after a short initial stage of pulses) in total ion fluxes to the substrate.

Язык оригиналаАнглийский
Страницы (с-по)465-469
Число страниц5
ЖурналProceedings, Annual Technical Conference - Society of Vacuum Coaters
СостояниеОпубликовано - 1 дек 2005
СобытиеSVC, Society of Vacuum Coaters - 48th Annual Technical Conference - Denver, CO, Соединенные Штаты Америки
Продолжительность: 23 апр 200528 апр 2005

ASJC Scopus subject areas

  • Mechanical Engineering
  • Surfaces and Interfaces
  • Fluid Flow and Transfer Processes
  • Surfaces, Coatings and Films

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