Calculation of the temperature field of a printed-circuit board with account for convective and radiative heat exchange on the board surface

V. P. Alekseev, G. V. Kuznetsov, S. V. Shloma

Результат исследований: Материалы для журналаСтатья

Аннотация

The temperature field of a printed-circuit board has been simulated numerically according to the two-dimensional thermal model with account for convective and radiative heat exchange on the board surface. The temperature fields in the actual printed-circuit board have been determined experimentally. The deviation of the results of the numerical analysis from the experimental data does not exceed ± 4°C.

Язык оригиналаАнглийский
Страницы (с-по)177-179
Число страниц3
ЖурналInzhenerno-Fizicheskii Zhurnal
Том75
Номер выпуска5
СостояниеОпубликовано - 2002
Опубликовано для внешнего пользованияДа

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Mechanical Engineering

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