Аннотация
The temperature field of a printed-circuit board has been simulated numerically according to the two-dimensional thermal model with account for convective and radiative heat exchange on the board surface. The temperature fields in the actual printed-circuit board have been determined experimentally. The deviation of the results of the numerical analysis from the experimental data does not exceed ± 4°C.
| Язык оригинала | Английский |
|---|---|
| Страницы (с-по) | 177-179 |
| Число страниц | 3 |
| Журнал | Inzhenerno-Fizicheskii Zhurnal |
| Том | 75 |
| Номер выпуска | 5 |
| Состояние | Опубликовано - 2002 |
| Опубликовано для внешнего пользования | Да |
ASJC Scopus subject areas
- Chemical Engineering(all)
- Mechanical Engineering