A new approach to numerical analysis of reliability indices in electronics

Kuznetsov Geniy, Kravchenko Evgeny

Результат исследований: Материалы для книги/типы отчетовМатериалы для конференции

6 Цитирования (Scopus)

Аннотация

Spatial modeling of unsteady temperature fields is conducted in a microelectronic printed circuit board (PCB) with an account of convective and radiation heat transfer with the environment. The data for numerical modeling of temperature fields serve as a basis for determining the aging characteristics of the polymer material as a structural component of electronic engineering products. The obtained results allow concluding on the necessity to consider spatial nonuniform temperature fields when estimating the degree of polymeric materials degradation at the continuous service of products, as well as on the impact of polymer aging on reliability features of microelectronic devices.

Язык оригиналаАнглийский
Название основной публикацииEPJ Web of Conferences
ИздательEDP Sciences
Том82
DOI
СостояниеОпубликовано - 20 янв 2015
СобытиеThermophysical Basis of Energy Technologies - 2014 - Tomsk, Российская Федерация
Продолжительность: 15 окт 201417 окт 2014

Другое

ДругоеThermophysical Basis of Energy Technologies - 2014
СтранаРоссийская Федерация
ГородTomsk
Период15.10.1417.10.14

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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