A measure using the eddy current technique on the effect of aluminum reconstruction in power semiconductor modules

T. A. Nguyen, D. Labrousse, P. Y. Joubert, S. Lefebvre, S. Bontemps

Результат исследования: Материалы для книги/типы отчетовМатериалы для конференции

Аннотация

The ageing of the metallization layer (aluminum reconstruction) which is due to power cycling on dies of power semiconductor modules results in the redistribution of the current lines in the metallization layer but also in the elementary cells of the power dies (MOSFET or IGBT) with a critical risk of failure when local current density or local temperature reach a critical value. The paper reports on the estimation of the local degradation of the aluminum sheet resistance due to power cycling which is evaluated by means of an eddy current sensor. First results of experimental data on power dies are presented for the first time.

Язык оригиналаАнглийский
Заголовок главной публикацииProceedings - PCIM Europe 2012
Подзаголовок главной публикацииInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
Страницы757-766
Количество страниц10
Статус публикацииОпубликовано - 1 дек 2012
Опубликовано для внешнего пользованияДа
СобытиеInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2012 - Nuremberg, Германия
Длительность: 8 мая 201210 мая 2012

Серии публикаций

Имя, фамилияPCIM Europe Conference Proceedings
ISSN (электронная версия)2191-3358

Конференция

КонференцияInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2012
СтранаГермания
ГородNuremberg
Период8.5.1210.5.12

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Цитировать

Nguyen, T. A., Labrousse, D., Joubert, P. Y., Lefebvre, S., & Bontemps, S. (2012). A measure using the eddy current technique on the effect of aluminum reconstruction in power semiconductor modules. В Proceedings - PCIM Europe 2012: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (стр. 757-766). (PCIM Europe Conference Proceedings).