Understanding tip-enhanced Raman spectroscopy by multiphysics finite element simulations

Vladimir Kolchuzhin, Jan Mehner, Evgeniya Sheremet, Bhattacharya Kunal, Raul D. Rodriguez, Dietrich R.T. Zahn

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This article deals with the models development and FE simulations for mechanical properties of all-metal AFM-TERS tips and electric field enhancement between the tip and the sample. The most important aspects in simulations, the parameters necessary in creating models, and the obtained results are presented and discussed in the article.

Original languageEnglish
Title of host publication2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479999507
DOIs
Publication statusPublished - 6 May 2015
Externally publishedYes
Event2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 - Budapest, Hungary
Duration: 19 Apr 201522 Apr 2015

Conference

Conference2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015
CountryHungary
CityBudapest
Period19.4.1522.4.15

ASJC Scopus subject areas

  • Computational Theory and Mathematics
  • Electrical and Electronic Engineering
  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering

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  • Cite this

    Kolchuzhin, V., Mehner, J., Sheremet, E., Kunal, B., Rodriguez, R. D., & Zahn, D. R. T. (2015). Understanding tip-enhanced Raman spectroscopy by multiphysics finite element simulations. In 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 [7103161] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EuroSimE.2015.7103161