Unconventional pairing in three-dimensional topological insulators with a warped surface state

A. S. Vasenko, A. A. Golubov, V. M. Silkin, E. V. Chulkov

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

We study the effect of the Fermi surface anisotropy (hexagonal warping) on the superconducting pair potential, induced in a three-dimensional topological insulator (TI) by proximity with an s-wave superconductor (S) in presence of a magnetic moment of a nearby ferromagnetic insulator (FI). In the previous studies, similar problem was treated with a simplified Hamiltonian, describing an isotropic Dirac cone dispersion. This approximation is only valid near the Dirac point. However, in topological insulators, the chemical potential often lies well above this point, where the Dirac cone is strongly anisotropic and its constant energy contour has a snowflake shape. Taking into account this shape, we show that a very exotic pair potential is induced on the topological insulator surface. Based on the symmetry arguments we also discuss the possibility of a supercurrent flowing along the S/FI interface, when an S/FI hybrid structure is formed on the TI surface.

Original languageEnglish
Pages (from-to)497-501
Number of pages5
JournalJETP Letters
Volume105
Issue number8
DOIs
Publication statusPublished - 1 Apr 2017
Externally publishedYes

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insulators
cones
hybrid structures
Fermi surfaces
proximity
magnetic moments
anisotropy
symmetry
approximation
energy

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

Unconventional pairing in three-dimensional topological insulators with a warped surface state. / Vasenko, A. S.; Golubov, A. A.; Silkin, V. M.; Chulkov, E. V.

In: JETP Letters, Vol. 105, No. 8, 01.04.2017, p. 497-501.

Research output: Contribution to journalArticle

Vasenko, A. S. ; Golubov, A. A. ; Silkin, V. M. ; Chulkov, E. V. / Unconventional pairing in three-dimensional topological insulators with a warped surface state. In: JETP Letters. 2017 ; Vol. 105, No. 8. pp. 497-501.
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