Treeing resistance parameters of polymeric dielectrics

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Treeing resistance parameters for polystyrene, polymethyl methacrylate, and polycarbonate are presented in this paper. It has been shown that for polymers with residual mechanical strain the greatest treeing resistance is observed for samples with higher tensile yield strength. To decrease the treeing growth rate or increase the breakdown time of polymeric dielectrics, the thermal diffusivity of base polymers should be reduced.

Original languageEnglish
Title of host publicationProceedings - 2012 7th International Forum on Strategic Technology, IFOST 2012
DOIs
Publication statusPublished - 2012
Event2012 7th International Forum on Strategic Technology, IFOST 2012 - Tomsk, Russian Federation
Duration: 18 Sep 201221 Sep 2012

Other

Other2012 7th International Forum on Strategic Technology, IFOST 2012
CountryRussian Federation
CityTomsk
Period18.9.1221.9.12

Keywords

  • breakdown time
  • polymeric dielectrics
  • residual strain
  • thermal diffusivity
  • Treeing resistance

ASJC Scopus subject areas

  • Management of Technology and Innovation

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    Gefle, O. S., & Lebedev, S. M. (2012). Treeing resistance parameters of polymeric dielectrics. In Proceedings - 2012 7th International Forum on Strategic Technology, IFOST 2012 [6357759] https://doi.org/10.1109/IFOST.2012.6357759