Abstract
Treeing resistance parameters for polystyrene, polymethyl methacrylate, and polycarbonate are presented in this paper. It has been shown that for polymers with residual mechanical strain the greatest treeing resistance is observed for samples with higher tensile yield strength. To decrease the treeing growth rate or increase the breakdown time of polymeric dielectrics, the thermal diffusivity of base polymers should be reduced.
| Original language | English |
|---|---|
| Title of host publication | Proceedings - 2012 7th International Forum on Strategic Technology, IFOST 2012 |
| DOIs | |
| Publication status | Published - 2012 |
| Event | 2012 7th International Forum on Strategic Technology, IFOST 2012 - Tomsk, Russian Federation Duration: 18 Sep 2012 → 21 Sep 2012 |
Other
| Other | 2012 7th International Forum on Strategic Technology, IFOST 2012 |
|---|---|
| Country | Russian Federation |
| City | Tomsk |
| Period | 18.9.12 → 21.9.12 |
Keywords
- breakdown time
- polymeric dielectrics
- residual strain
- thermal diffusivity
- Treeing resistance
ASJC Scopus subject areas
- Management of Technology and Innovation
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Gefle, O. S., & Lebedev, S. M. (2012). Treeing resistance parameters of polymeric dielectrics. In Proceedings - 2012 7th International Forum on Strategic Technology, IFOST 2012 [6357759] https://doi.org/10.1109/IFOST.2012.6357759