Abstract
Treeing resistance parameters for polystyrene, polymethyl methacrylate, and polycarbonate are presented in this paper. It has been shown that for polymers with residual mechanical strain the greatest treeing resistance is observed for samples with higher tensile yield strength. To decrease the treeing growth rate or increase the breakdown time of polymeric dielectrics, the thermal diffusivity of base polymers should be reduced.
| Original language | English |
|---|---|
| Title of host publication | Proceedings - 2012 7th International Forum on Strategic Technology, IFOST 2012 |
| DOIs | |
| Publication status | Published - 2012 |
| Event | 2012 7th International Forum on Strategic Technology, IFOST 2012 - Tomsk, Russian Federation Duration: 18 Sep 2012 → 21 Sep 2012 |
Other
| Other | 2012 7th International Forum on Strategic Technology, IFOST 2012 |
|---|---|
| Country | Russian Federation |
| City | Tomsk |
| Period | 18.9.12 → 21.9.12 |
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Keywords
- breakdown time
- polymeric dielectrics
- residual strain
- thermal diffusivity
- Treeing resistance
ASJC Scopus subject areas
- Management of Technology and Innovation
Cite this
Treeing resistance parameters of polymeric dielectrics. / Gefle, O. S.; Lebedev, S. M.
Proceedings - 2012 7th International Forum on Strategic Technology, IFOST 2012. 2012. 6357759.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Treeing resistance parameters of polymeric dielectrics
AU - Gefle, O. S.
AU - Lebedev, S. M.
PY - 2012
Y1 - 2012
N2 - Treeing resistance parameters for polystyrene, polymethyl methacrylate, and polycarbonate are presented in this paper. It has been shown that for polymers with residual mechanical strain the greatest treeing resistance is observed for samples with higher tensile yield strength. To decrease the treeing growth rate or increase the breakdown time of polymeric dielectrics, the thermal diffusivity of base polymers should be reduced.
AB - Treeing resistance parameters for polystyrene, polymethyl methacrylate, and polycarbonate are presented in this paper. It has been shown that for polymers with residual mechanical strain the greatest treeing resistance is observed for samples with higher tensile yield strength. To decrease the treeing growth rate or increase the breakdown time of polymeric dielectrics, the thermal diffusivity of base polymers should be reduced.
KW - breakdown time
KW - polymeric dielectrics
KW - residual strain
KW - thermal diffusivity
KW - Treeing resistance
UR - http://www.scopus.com/inward/record.url?scp=84871846934&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84871846934&partnerID=8YFLogxK
U2 - 10.1109/IFOST.2012.6357759
DO - 10.1109/IFOST.2012.6357759
M3 - Conference contribution
SN - 9781467317702
BT - Proceedings - 2012 7th International Forum on Strategic Technology, IFOST 2012
ER -