Toughness of hard nanostructured ceramic thin films

J. Musil, M. Jirout

Research output: Contribution to journalArticle

197 Citations (Scopus)

Abstract

This article reports on the investigation of cracking of hard, 3-5 μm thick Zr-Cu-O, Zr-Cu-C, Ti-Cu-C and Si-Me-N (Me = Ta, Zr, Mo, W) magnetron sputtered nanostructured films using microindentation measurements. Main aim of this investigation is to determine the interrelationships between the cracking of film, its structure and mechanical properties and to assess the toughness of thin film. Correlations between the formation of cracks, the mechanical properties of film and substrate, structure of film and macrostress σ generated in the film during its growth were investigated in detail. It was found that the resistance of the film to cracking increases with increasing ratio Hf3/Ef*2. It was found that (1) the correct assessment of toughness of the thin film requires to investigate the system thin film/substrate as one unit because mechanical properties of the substrate play a decisive role in the formation of cracks, (2) the strongest parameter influencing the formation of cracks is the film structure and its macrostress σ and (3) nanostructured films with X-ray amorphous structure and small compressive macrostress (σ ≈ - 0.1 GPa) are very stable against the cracking even at high values of the film hardness Hf exceeding 20 GPa.

Original languageEnglish
Pages (from-to)5148-5152
Number of pages5
JournalSurface and Coatings Technology
Volume201
Issue number9-11 SPEC. ISS.
DOIs
Publication statusPublished - 26 Feb 2007

Fingerprint

toughness
Toughness
ceramics
Thin films
thin films
cracks
mechanical properties
Cracks
Mechanical properties
Substrates
microhardness
hardness
Hardness
X rays

Keywords

  • Film cracking
  • Magnetron sputtering
  • Mechanical properties
  • Structure
  • Thin film
  • Toughness

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

Cite this

Toughness of hard nanostructured ceramic thin films. / Musil, J.; Jirout, M.

In: Surface and Coatings Technology, Vol. 201, No. 9-11 SPEC. ISS., 26.02.2007, p. 5148-5152.

Research output: Contribution to journalArticle

Musil, J. ; Jirout, M. / Toughness of hard nanostructured ceramic thin films. In: Surface and Coatings Technology. 2007 ; Vol. 201, No. 9-11 SPEC. ISS. pp. 5148-5152.
@article{59174f7d565b4e119caa9899f3da58f5,
title = "Toughness of hard nanostructured ceramic thin films",
abstract = "This article reports on the investigation of cracking of hard, 3-5 μm thick Zr-Cu-O, Zr-Cu-C, Ti-Cu-C and Si-Me-N (Me = Ta, Zr, Mo, W) magnetron sputtered nanostructured films using microindentation measurements. Main aim of this investigation is to determine the interrelationships between the cracking of film, its structure and mechanical properties and to assess the toughness of thin film. Correlations between the formation of cracks, the mechanical properties of film and substrate, structure of film and macrostress σ generated in the film during its growth were investigated in detail. It was found that the resistance of the film to cracking increases with increasing ratio Hf3/Ef*2. It was found that (1) the correct assessment of toughness of the thin film requires to investigate the system thin film/substrate as one unit because mechanical properties of the substrate play a decisive role in the formation of cracks, (2) the strongest parameter influencing the formation of cracks is the film structure and its macrostress σ and (3) nanostructured films with X-ray amorphous structure and small compressive macrostress (σ ≈ - 0.1 GPa) are very stable against the cracking even at high values of the film hardness Hf exceeding 20 GPa.",
keywords = "Film cracking, Magnetron sputtering, Mechanical properties, Structure, Thin film, Toughness",
author = "J. Musil and M. Jirout",
year = "2007",
month = "2",
day = "26",
doi = "10.1016/j.surfcoat.2006.07.020",
language = "English",
volume = "201",
pages = "5148--5152",
journal = "Surface and Coatings Technology",
issn = "0257-8972",
publisher = "Elsevier",
number = "9-11 SPEC. ISS.",

}

TY - JOUR

T1 - Toughness of hard nanostructured ceramic thin films

AU - Musil, J.

AU - Jirout, M.

PY - 2007/2/26

Y1 - 2007/2/26

N2 - This article reports on the investigation of cracking of hard, 3-5 μm thick Zr-Cu-O, Zr-Cu-C, Ti-Cu-C and Si-Me-N (Me = Ta, Zr, Mo, W) magnetron sputtered nanostructured films using microindentation measurements. Main aim of this investigation is to determine the interrelationships between the cracking of film, its structure and mechanical properties and to assess the toughness of thin film. Correlations between the formation of cracks, the mechanical properties of film and substrate, structure of film and macrostress σ generated in the film during its growth were investigated in detail. It was found that the resistance of the film to cracking increases with increasing ratio Hf3/Ef*2. It was found that (1) the correct assessment of toughness of the thin film requires to investigate the system thin film/substrate as one unit because mechanical properties of the substrate play a decisive role in the formation of cracks, (2) the strongest parameter influencing the formation of cracks is the film structure and its macrostress σ and (3) nanostructured films with X-ray amorphous structure and small compressive macrostress (σ ≈ - 0.1 GPa) are very stable against the cracking even at high values of the film hardness Hf exceeding 20 GPa.

AB - This article reports on the investigation of cracking of hard, 3-5 μm thick Zr-Cu-O, Zr-Cu-C, Ti-Cu-C and Si-Me-N (Me = Ta, Zr, Mo, W) magnetron sputtered nanostructured films using microindentation measurements. Main aim of this investigation is to determine the interrelationships between the cracking of film, its structure and mechanical properties and to assess the toughness of thin film. Correlations between the formation of cracks, the mechanical properties of film and substrate, structure of film and macrostress σ generated in the film during its growth were investigated in detail. It was found that the resistance of the film to cracking increases with increasing ratio Hf3/Ef*2. It was found that (1) the correct assessment of toughness of the thin film requires to investigate the system thin film/substrate as one unit because mechanical properties of the substrate play a decisive role in the formation of cracks, (2) the strongest parameter influencing the formation of cracks is the film structure and its macrostress σ and (3) nanostructured films with X-ray amorphous structure and small compressive macrostress (σ ≈ - 0.1 GPa) are very stable against the cracking even at high values of the film hardness Hf exceeding 20 GPa.

KW - Film cracking

KW - Magnetron sputtering

KW - Mechanical properties

KW - Structure

KW - Thin film

KW - Toughness

UR - http://www.scopus.com/inward/record.url?scp=33846484208&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33846484208&partnerID=8YFLogxK

U2 - 10.1016/j.surfcoat.2006.07.020

DO - 10.1016/j.surfcoat.2006.07.020

M3 - Article

VL - 201

SP - 5148

EP - 5152

JO - Surface and Coatings Technology

JF - Surface and Coatings Technology

SN - 0257-8972

IS - 9-11 SPEC. ISS.

ER -