Thermophysical Properties of Polymer Materials with High Thermal Conductivity

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1 Citation (Scopus)

Abstract

Results of studies on the main thermophysical properties of new thermally conductive polymer materials are presented. It is shown that modification of polymer dielectrics by micron-sized fillers allows thermally conductive materials with thermal conductivity not less than 2 W/(m K) to be produced, which makes it possible to use such materials as cooling elements of various electrical engineering and semiconductor equipment and devices.

Original languageEnglish
JournalRussian Physics Journal
DOIs
Publication statusAccepted/In press - 6 Jun 2015

Fingerprint

thermophysical properties
thermal conductivity
electrical engineering
polymers
fillers
cooling

Keywords

  • thermal conductivity
  • thermal diffusivity
  • thermally conductive polymer materials

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

@article{cc5f510d54994ba28a03b7504f526dc3,
title = "Thermophysical Properties of Polymer Materials with High Thermal Conductivity",
abstract = "Results of studies on the main thermophysical properties of new thermally conductive polymer materials are presented. It is shown that modification of polymer dielectrics by micron-sized fillers allows thermally conductive materials with thermal conductivity not less than 2 W/(m K) to be produced, which makes it possible to use such materials as cooling elements of various electrical engineering and semiconductor equipment and devices.",
keywords = "thermal conductivity, thermal diffusivity, thermally conductive polymer materials",
author = "Lebedev, {S. M.} and Gefle, {O. S.} and Dneprovskii, {S. N.} and Ernar Tanirbergenuly Amitov",
year = "2015",
month = "6",
day = "6",
doi = "10.1007/s11182-015-0491-z",
language = "English",
journal = "Russian Physics Journal",
issn = "1064-8887",
publisher = "Consultants Bureau",

}

TY - JOUR

T1 - Thermophysical Properties of Polymer Materials with High Thermal Conductivity

AU - Lebedev, S. M.

AU - Gefle, O. S.

AU - Dneprovskii, S. N.

AU - Amitov, Ernar Tanirbergenuly

PY - 2015/6/6

Y1 - 2015/6/6

N2 - Results of studies on the main thermophysical properties of new thermally conductive polymer materials are presented. It is shown that modification of polymer dielectrics by micron-sized fillers allows thermally conductive materials with thermal conductivity not less than 2 W/(m K) to be produced, which makes it possible to use such materials as cooling elements of various electrical engineering and semiconductor equipment and devices.

AB - Results of studies on the main thermophysical properties of new thermally conductive polymer materials are presented. It is shown that modification of polymer dielectrics by micron-sized fillers allows thermally conductive materials with thermal conductivity not less than 2 W/(m K) to be produced, which makes it possible to use such materials as cooling elements of various electrical engineering and semiconductor equipment and devices.

KW - thermal conductivity

KW - thermal diffusivity

KW - thermally conductive polymer materials

UR - http://www.scopus.com/inward/record.url?scp=84930535920&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84930535920&partnerID=8YFLogxK

U2 - 10.1007/s11182-015-0491-z

DO - 10.1007/s11182-015-0491-z

M3 - Article

JO - Russian Physics Journal

JF - Russian Physics Journal

SN - 1064-8887

ER -