Results of studies on the main thermophysical properties of new thermally conductive polymer materials are presented. It is shown that modification of polymer dielectrics by micron-sized fillers allows thermally conductive materials with thermal conductivity not less than 2 W/(m K) to be produced, which makes it possible to use such materials as cooling elements of various electrical engineering and semiconductor equipment and devices.
- thermal conductivity
- thermal diffusivity
- thermally conductive polymer materials
ASJC Scopus subject areas
- Physics and Astronomy(all)