Thermoelectric cooling for bare dies power devices embedded in pcb substrates

Shuangfeng Zhang, Eric Laboure, Denis Labrousselabrousse, Stéphane Lefebvre

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Efficient thermal solutions are becoming a challenging issue in integrated power boards based on PCB substrate in which bare dies can be embedded. The purpose of this paper is to study and compare different solutions based on thermal vias, thick PCB copper layers and thermoelectric coolers (TECs). For TEC, multiphysics 3D simulations using Finite Element Method (FEM) are performed to define their optimum parameters leading to the maximum coefficient of performance (COP). Experiments have been performed to validate the 3D thermal models. These experiments are based on a test-bench providing thermal heat flux measurement in order to compare thermal performances of the different cooling solutions.

Original languageEnglish
Title of host publicationPCIM Europe Conference Proceedings
EditorsAchim Scharf
PublisherMesago PCIM GmbH
Pages1408-1415
Number of pages8
Edition225809
ISBN (Print)9783800746460
Publication statusPublished - 1 Jan 2018
Externally publishedYes
EventInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018 - Nuremberg, Germany
Duration: 5 Jun 20187 Jun 2018

Publication series

NamePCIM Europe Conference Proceedings
Number225809
ISSN (Electronic)2191-3358

Conference

ConferenceInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018
CountryGermany
CityNuremberg
Period5.6.187.6.18

Fingerprint

Cooling
Substrates
Polychlorinated biphenyls
Heat flux
Experiments
Hot Temperature
Copper
Finite element method

Keywords

  • Calorimetric method
  • Cooling solutions
  • PCB substrates
  • Power losses
  • TEC device
  • Thermal vias

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Zhang, S., Laboure, E., Labrousselabrousse, D., & Lefebvre, S. (2018). Thermoelectric cooling for bare dies power devices embedded in pcb substrates. In A. Scharf (Ed.), PCIM Europe Conference Proceedings (225809 ed., pp. 1408-1415). (PCIM Europe Conference Proceedings; No. 225809). Mesago PCIM GmbH.

Thermoelectric cooling for bare dies power devices embedded in pcb substrates. / Zhang, Shuangfeng; Laboure, Eric; Labrousselabrousse, Denis; Lefebvre, Stéphane.

PCIM Europe Conference Proceedings. ed. / Achim Scharf. 225809. ed. Mesago PCIM GmbH, 2018. p. 1408-1415 (PCIM Europe Conference Proceedings; No. 225809).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Zhang, S, Laboure, E, Labrousselabrousse, D & Lefebvre, S 2018, Thermoelectric cooling for bare dies power devices embedded in pcb substrates. in A Scharf (ed.), PCIM Europe Conference Proceedings. 225809 edn, PCIM Europe Conference Proceedings, no. 225809, Mesago PCIM GmbH, pp. 1408-1415, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018, Nuremberg, Germany, 5.6.18.
Zhang S, Laboure E, Labrousselabrousse D, Lefebvre S. Thermoelectric cooling for bare dies power devices embedded in pcb substrates. In Scharf A, editor, PCIM Europe Conference Proceedings. 225809 ed. Mesago PCIM GmbH. 2018. p. 1408-1415. (PCIM Europe Conference Proceedings; 225809).
Zhang, Shuangfeng ; Laboure, Eric ; Labrousselabrousse, Denis ; Lefebvre, Stéphane. / Thermoelectric cooling for bare dies power devices embedded in pcb substrates. PCIM Europe Conference Proceedings. editor / Achim Scharf. 225809. ed. Mesago PCIM GmbH, 2018. pp. 1408-1415 (PCIM Europe Conference Proceedings; 225809).
@inproceedings{7e73f24580504b1fa659904010c5ad21,
title = "Thermoelectric cooling for bare dies power devices embedded in pcb substrates",
abstract = "Efficient thermal solutions are becoming a challenging issue in integrated power boards based on PCB substrate in which bare dies can be embedded. The purpose of this paper is to study and compare different solutions based on thermal vias, thick PCB copper layers and thermoelectric coolers (TECs). For TEC, multiphysics 3D simulations using Finite Element Method (FEM) are performed to define their optimum parameters leading to the maximum coefficient of performance (COP). Experiments have been performed to validate the 3D thermal models. These experiments are based on a test-bench providing thermal heat flux measurement in order to compare thermal performances of the different cooling solutions.",
keywords = "Calorimetric method, Cooling solutions, PCB substrates, Power losses, TEC device, Thermal vias",
author = "Shuangfeng Zhang and Eric Laboure and Denis Labrousselabrousse and St{\'e}phane Lefebvre",
year = "2018",
month = "1",
day = "1",
language = "English",
isbn = "9783800746460",
series = "PCIM Europe Conference Proceedings",
publisher = "Mesago PCIM GmbH",
number = "225809",
pages = "1408--1415",
editor = "Achim Scharf",
booktitle = "PCIM Europe Conference Proceedings",
edition = "225809",

}

TY - GEN

T1 - Thermoelectric cooling for bare dies power devices embedded in pcb substrates

AU - Zhang, Shuangfeng

AU - Laboure, Eric

AU - Labrousselabrousse, Denis

AU - Lefebvre, Stéphane

PY - 2018/1/1

Y1 - 2018/1/1

N2 - Efficient thermal solutions are becoming a challenging issue in integrated power boards based on PCB substrate in which bare dies can be embedded. The purpose of this paper is to study and compare different solutions based on thermal vias, thick PCB copper layers and thermoelectric coolers (TECs). For TEC, multiphysics 3D simulations using Finite Element Method (FEM) are performed to define their optimum parameters leading to the maximum coefficient of performance (COP). Experiments have been performed to validate the 3D thermal models. These experiments are based on a test-bench providing thermal heat flux measurement in order to compare thermal performances of the different cooling solutions.

AB - Efficient thermal solutions are becoming a challenging issue in integrated power boards based on PCB substrate in which bare dies can be embedded. The purpose of this paper is to study and compare different solutions based on thermal vias, thick PCB copper layers and thermoelectric coolers (TECs). For TEC, multiphysics 3D simulations using Finite Element Method (FEM) are performed to define their optimum parameters leading to the maximum coefficient of performance (COP). Experiments have been performed to validate the 3D thermal models. These experiments are based on a test-bench providing thermal heat flux measurement in order to compare thermal performances of the different cooling solutions.

KW - Calorimetric method

KW - Cooling solutions

KW - PCB substrates

KW - Power losses

KW - TEC device

KW - Thermal vias

UR - http://www.scopus.com/inward/record.url?scp=85067049546&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85067049546&partnerID=8YFLogxK

M3 - Conference contribution

SN - 9783800746460

T3 - PCIM Europe Conference Proceedings

SP - 1408

EP - 1415

BT - PCIM Europe Conference Proceedings

A2 - Scharf, Achim

PB - Mesago PCIM GmbH

ER -