Abstract
Efficient thermal solutions are becoming a challenging issue in integrated power boards based on PCB substrate in which bare dies can be embedded. The purpose of this paper is to study and compare different solutions based on thermal vias, thick PCB copper layers and thermoelectric coolers (TECs). For TEC, multiphysics 3D simulations using Finite Element Method (FEM) are performed to define their optimum parameters leading to the maximum coefficient of performance (COP). Experiments have been performed to validate the 3D thermal models. These experiments are based on a test-bench providing thermal heat flux measurement in order to compare thermal performances of the different cooling solutions.
| Original language | English |
|---|---|
| Title of host publication | PCIM Europe Conference Proceedings |
| Editors | Achim Scharf |
| Publisher | Mesago PCIM GmbH |
| Pages | 1408-1415 |
| Number of pages | 8 |
| Edition | 225809 |
| ISBN (Print) | 9783800746460 |
| Publication status | Published - 1 Jan 2018 |
| Externally published | Yes |
| Event | International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018 - Nuremberg, Germany Duration: 5 Jun 2018 → 7 Jun 2018 |
Publication series
| Name | PCIM Europe Conference Proceedings |
|---|---|
| Number | 225809 |
| ISSN (Electronic) | 2191-3358 |
Conference
| Conference | International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018 |
|---|---|
| Country | Germany |
| City | Nuremberg |
| Period | 5.6.18 → 7.6.18 |
Fingerprint
Keywords
- Calorimetric method
- Cooling solutions
- PCB substrates
- Power losses
- TEC device
- Thermal vias
ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
Thermoelectric cooling for bare dies power devices embedded in pcb substrates. / Zhang, Shuangfeng; Laboure, Eric; Labrousselabrousse, Denis; Lefebvre, Stéphane.
PCIM Europe Conference Proceedings. ed. / Achim Scharf. 225809. ed. Mesago PCIM GmbH, 2018. p. 1408-1415 (PCIM Europe Conference Proceedings; No. 225809).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Thermoelectric cooling for bare dies power devices embedded in pcb substrates
AU - Zhang, Shuangfeng
AU - Laboure, Eric
AU - Labrousselabrousse, Denis
AU - Lefebvre, Stéphane
PY - 2018/1/1
Y1 - 2018/1/1
N2 - Efficient thermal solutions are becoming a challenging issue in integrated power boards based on PCB substrate in which bare dies can be embedded. The purpose of this paper is to study and compare different solutions based on thermal vias, thick PCB copper layers and thermoelectric coolers (TECs). For TEC, multiphysics 3D simulations using Finite Element Method (FEM) are performed to define their optimum parameters leading to the maximum coefficient of performance (COP). Experiments have been performed to validate the 3D thermal models. These experiments are based on a test-bench providing thermal heat flux measurement in order to compare thermal performances of the different cooling solutions.
AB - Efficient thermal solutions are becoming a challenging issue in integrated power boards based on PCB substrate in which bare dies can be embedded. The purpose of this paper is to study and compare different solutions based on thermal vias, thick PCB copper layers and thermoelectric coolers (TECs). For TEC, multiphysics 3D simulations using Finite Element Method (FEM) are performed to define their optimum parameters leading to the maximum coefficient of performance (COP). Experiments have been performed to validate the 3D thermal models. These experiments are based on a test-bench providing thermal heat flux measurement in order to compare thermal performances of the different cooling solutions.
KW - Calorimetric method
KW - Cooling solutions
KW - PCB substrates
KW - Power losses
KW - TEC device
KW - Thermal vias
UR - http://www.scopus.com/inward/record.url?scp=85067049546&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85067049546&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85067049546
SN - 9783800746460
T3 - PCIM Europe Conference Proceedings
SP - 1408
EP - 1415
BT - PCIM Europe Conference Proceedings
A2 - Scharf, Achim
PB - Mesago PCIM GmbH
ER -