Abstract
Efficient thermal solutions are becoming a challenging issue in integrated power boards based on PCB substrate in which bare dies can be embedded. The purpose of this paper is to study and compare different solutions based on thermal vias, thick PCB copper layers and thermoelectric coolers (TECs). For TEC, multiphysics 3D simulations using Finite Element Method (FEM) are performed to define their optimum parameters leading to the maximum coefficient of performance (COP). Experiments have been performed to validate the 3D thermal models. These experiments are based on a test-bench providing thermal heat flux measurement in order to compare thermal performances of the different cooling solutions.
| Original language | English |
|---|---|
| Title of host publication | PCIM Europe Conference Proceedings |
| Editors | Achim Scharf |
| Publisher | Mesago PCIM GmbH |
| Pages | 1408-1415 |
| Number of pages | 8 |
| Edition | 225809 |
| ISBN (Print) | 9783800746460 |
| Publication status | Published - 1 Jan 2018 |
| Externally published | Yes |
| Event | International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018 - Nuremberg, Germany Duration: 5 Jun 2018 → 7 Jun 2018 |
Publication series
| Name | PCIM Europe Conference Proceedings |
|---|---|
| Number | 225809 |
| ISSN (Electronic) | 2191-3358 |
Conference
| Conference | International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018 |
|---|---|
| Country | Germany |
| City | Nuremberg |
| Period | 5.6.18 → 7.6.18 |
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Keywords
- Calorimetric method
- Cooling solutions
- PCB substrates
- Power losses
- TEC device
- Thermal vias
ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
Zhang, S., Laboure, E., Labrousselabrousse, D., & Lefebvre, S. (2018). Thermoelectric cooling for bare dies power devices embedded in pcb substrates. In A. Scharf (Ed.), PCIM Europe Conference Proceedings (225809 ed., pp. 1408-1415). (PCIM Europe Conference Proceedings; No. 225809). Mesago PCIM GmbH.