Thermoelectric cooling for bare dies power devices embedded in pcb substrates

Shuangfeng Zhang, Eric Laboure, Denis Labrousselabrousse, Stéphane Lefebvre

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Efficient thermal solutions are becoming a challenging issue in integrated power boards based on PCB substrate in which bare dies can be embedded. The purpose of this paper is to study and compare different solutions based on thermal vias, thick PCB copper layers and thermoelectric coolers (TECs). For TEC, multiphysics 3D simulations using Finite Element Method (FEM) are performed to define their optimum parameters leading to the maximum coefficient of performance (COP). Experiments have been performed to validate the 3D thermal models. These experiments are based on a test-bench providing thermal heat flux measurement in order to compare thermal performances of the different cooling solutions.

Original languageEnglish
Title of host publicationPCIM Europe Conference Proceedings
EditorsAchim Scharf
PublisherMesago PCIM GmbH
Pages1408-1415
Number of pages8
Edition225809
ISBN (Print)9783800746460
Publication statusPublished - 1 Jan 2018
Externally publishedYes
EventInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018 - Nuremberg, Germany
Duration: 5 Jun 20187 Jun 2018

Publication series

NamePCIM Europe Conference Proceedings
Number225809
ISSN (Electronic)2191-3358

Conference

ConferenceInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018
CountryGermany
CityNuremberg
Period5.6.187.6.18

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Keywords

  • Calorimetric method
  • Cooling solutions
  • PCB substrates
  • Power losses
  • TEC device
  • Thermal vias

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Zhang, S., Laboure, E., Labrousselabrousse, D., & Lefebvre, S. (2018). Thermoelectric cooling for bare dies power devices embedded in pcb substrates. In A. Scharf (Ed.), PCIM Europe Conference Proceedings (225809 ed., pp. 1408-1415). (PCIM Europe Conference Proceedings; No. 225809). Mesago PCIM GmbH.