@inproceedings{7e73f24580504b1fa659904010c5ad21,
title = "Thermoelectric cooling for bare dies power devices embedded in pcb substrates",
abstract = "Efficient thermal solutions are becoming a challenging issue in integrated power boards based on PCB substrate in which bare dies can be embedded. The purpose of this paper is to study and compare different solutions based on thermal vias, thick PCB copper layers and thermoelectric coolers (TECs). For TEC, multiphysics 3D simulations using Finite Element Method (FEM) are performed to define their optimum parameters leading to the maximum coefficient of performance (COP). Experiments have been performed to validate the 3D thermal models. These experiments are based on a test-bench providing thermal heat flux measurement in order to compare thermal performances of the different cooling solutions.",
keywords = "Calorimetric method, Cooling solutions, PCB substrates, Power losses, TEC device, Thermal vias",
author = "Shuangfeng Zhang and Eric Laboure and Denis Labrousselabrousse and St{\'e}phane Lefebvre",
year = "2018",
month = jan,
day = "1",
language = "English",
isbn = "9783800746460",
series = "PCIM Europe Conference Proceedings",
publisher = "Mesago PCIM GmbH",
number = "225809",
pages = "1408--1415",
editor = "Achim Scharf",
booktitle = "PCIM Europe Conference Proceedings",
edition = "225809",
note = "International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018 ; Conference date: 05-06-2018 Through 07-06-2018",
}