Thermocapillary deformation of a water layer at local heating

V. V. Cheverda, A. A. Fedorets, I. V. Marchuk, O. A. Kabov

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

A horizontal water layer of 0.29-0.44 mm thickness, locally heated from the substrate, is investigated. The value of thermocapillary deformation occurring at local heating is measured by an inverted laser scanning confocal microscope Zeiss LSM 510 Meta. The heater in the form of strip of 0.5-mm width, 40-mm length, and 0.5-mm height made of indium oxide is sputtered on a sapphire substrate. The water temperature from the side of the substrate is measured using the infrared scanner Titanium 570M. We studied in detail the effect of the initial layer thickness and heating power on the value of thermocapillary deformation and temperature field. It is shown that deformation increases with an increase in thermal capacity and decrease in the layer thickness. Results of numerical simulation are in good qualitative agreement with the measurement results.

Original languageEnglish
Pages (from-to)231-236
Number of pages6
JournalThermophysics and Aeromechanics
Volume23
Issue number2
DOIs
Publication statusPublished - 1 Mar 2016

Fingerprint

heating
infrared scanners
water
water temperature
heaters
indium oxides
strip
sapphire
temperature distribution
titanium
microscopes
scanning
lasers
simulation

Keywords

  • liquid layer
  • local heating
  • thermocapillary convection
  • thermocapillary deformation

ASJC Scopus subject areas

  • Nuclear and High Energy Physics
  • Radiation

Cite this

Thermocapillary deformation of a water layer at local heating. / Cheverda, V. V.; Fedorets, A. A.; Marchuk, I. V.; Kabov, O. A.

In: Thermophysics and Aeromechanics, Vol. 23, No. 2, 01.03.2016, p. 231-236.

Research output: Contribution to journalArticle

Cheverda, V. V. ; Fedorets, A. A. ; Marchuk, I. V. ; Kabov, O. A. / Thermocapillary deformation of a water layer at local heating. In: Thermophysics and Aeromechanics. 2016 ; Vol. 23, No. 2. pp. 231-236.
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