Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices

M. Bouarroudj, Z. Khatir, S. Lefebvre, L. Dupont

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

The crack and delamination of solder joints between base plates and DCB substrates of power modules is one of the most frequently encountered failure mode and studied in literature. In this paper we present numerical effects of solder meniscus design in solder lifetime prediction. Especially, we show the effect of singular points, which appear in the border edges or comers of DCB or solder joints geometries, in mechanical stress, strain and plastic work evaluations. Furthermore the effect of mesh density on mechanical stress and strains is Shown. Finally, we will see the effect of the meniscus design of the solder joint on lifetime estimation using both plastic strain-based and energy-based models.

Original languageEnglish
Title of host publicationEuroSime 2007
Subtitle of host publicationInternational Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007
DOIs
Publication statusPublished - 27 Nov 2007
Externally publishedYes
EventEuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007 - London, United Kingdom
Duration: 16 Apr 200718 Apr 2007

Publication series

NameEuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007

Conference

ConferenceEuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007
CountryUnited Kingdom
CityLondon
Period16.4.0718.4.07

Fingerprint

menisci
solders
Power electronics
Soldering alloys
life (durability)
electronics
plastics
failure modes
borders
Delamination
Failure modes
mesh
Plastic deformation
cracks
Plastics
Cracks
Geometry
evaluation
Substrates
geometry

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Condensed Matter Physics

Cite this

Bouarroudj, M., Khatir, Z., Lefebvre, S., & Dupont, L. (2007). Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices. In EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007 [4201184] (EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007). https://doi.org/10.1109/ESIME.2007.360017

Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices. / Bouarroudj, M.; Khatir, Z.; Lefebvre, S.; Dupont, L.

EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. 2007. 4201184 (EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bouarroudj, M, Khatir, Z, Lefebvre, S & Dupont, L 2007, Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices. in EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007., 4201184, EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007, EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007, London, United Kingdom, 16.4.07. https://doi.org/10.1109/ESIME.2007.360017
Bouarroudj M, Khatir Z, Lefebvre S, Dupont L. Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices. In EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. 2007. 4201184. (EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007). https://doi.org/10.1109/ESIME.2007.360017
Bouarroudj, M. ; Khatir, Z. ; Lefebvre, S. ; Dupont, L. / Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices. EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. 2007. (EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007).
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