Thermal management for GaN power devices mounted on PCB substrates

Shuangfeng Zhang, Eric Laboure, Denis Labrousse, Stephane Lefebvre

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

This paper investigates different thermal management solutions for GaN HEMT mounted on Printed Circuit Board (PCB) substrates. Wide bandgap (WBG) power semiconductors like GaN devices have the ability to operate at high switching-frequency (from few 100 kHz to several MHz). To take advantage of their high frequency switching capabilities, the parasitic inductances of power connections as well as the connections between the dies and the gate driver must be minimized. So the majority of GaN chips available on the market are packaged so that they can be directly attached to a PCB. The embedding technology of GaN dies in PCB substrate is attractive because it offers various interconnection possibilities. However, the low thermal conductivity of glass epoxy will result in high thermal resistance of the substrate. So it is of the first importance to seek technological means in order to improve the cooling of GaN chips soldered or embedded in such PCB structures.

Original languageEnglish
Title of host publication2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509042784
DOIs
Publication statusPublished - 31 May 2017
Externally publishedYes
Event2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017 - Delft, Netherlands
Duration: 5 Apr 20177 Apr 2017

Publication series

Name2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017

Conference

Conference2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017
CountryNetherlands
CityDelft
Period5.4.177.4.17

Keywords

  • 3D Packaging
  • GaN HEMT
  • PCB substrates
  • thermal management solutions

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Polymers and Plastics

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  • Cite this

    Zhang, S., Laboure, E., Labrousse, D., & Lefebvre, S. (2017). Thermal management for GaN power devices mounted on PCB substrates. In 2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017 [7936752] (2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IWIPP.2017.7936752