Abstract
The technology of high power IGBT modules has been improved significantly these last years against thermal fatigue and the first weaknesses related to the bonding die attach have been well enough corrected. Nowadays, the most frequently observed failure mode is the solder layer cracks between copper base plate material and the ceramic. Experimental tests must be completed by numerical simulation tools in order to analyze this type of failure related to power cycling constraints. Thermal simulations of high power IGBT modules based on boundary element method are described in this paper. A validation of the numerical tool is shown in steady-state and dynamic operations during a power cycle by comparison with experimental measurements. Finally, using the software, a model of solder layer cracks between copper base plate and the DCB ceramic is applied in order to investigate its effect on the thermal constraints.
| Original language | English |
|---|---|
| Pages | 271-274 |
| Number of pages | 4 |
| Publication status | Published - 1 Dec 2000 |
| Externally published | Yes |
| Event | 12th International Symposium on Power Semiconductor Devices and ICs - Toulouse, France Duration: 22 May 2000 → 25 May 2000 |
Conference
| Conference | 12th International Symposium on Power Semiconductor Devices and ICs |
|---|---|
| Country | France |
| City | Toulouse |
| Period | 22.5.00 → 25.5.00 |
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Keywords
- Boundary element method
- IGBT modules
- Power cycling
- Thermal analysis
- Thermal modeling
- Thermal resistance
ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
Thermal analysis of high power IGBT modules. / Khatir, Z.; Lefebvre, S.
2000. 271-274 Paper presented at 12th International Symposium on Power Semiconductor Devices and ICs, Toulouse, France.Research output: Contribution to conference › Paper
}
TY - CONF
T1 - Thermal analysis of high power IGBT modules
AU - Khatir, Z.
AU - Lefebvre, S.
PY - 2000/12/1
Y1 - 2000/12/1
N2 - The technology of high power IGBT modules has been improved significantly these last years against thermal fatigue and the first weaknesses related to the bonding die attach have been well enough corrected. Nowadays, the most frequently observed failure mode is the solder layer cracks between copper base plate material and the ceramic. Experimental tests must be completed by numerical simulation tools in order to analyze this type of failure related to power cycling constraints. Thermal simulations of high power IGBT modules based on boundary element method are described in this paper. A validation of the numerical tool is shown in steady-state and dynamic operations during a power cycle by comparison with experimental measurements. Finally, using the software, a model of solder layer cracks between copper base plate and the DCB ceramic is applied in order to investigate its effect on the thermal constraints.
AB - The technology of high power IGBT modules has been improved significantly these last years against thermal fatigue and the first weaknesses related to the bonding die attach have been well enough corrected. Nowadays, the most frequently observed failure mode is the solder layer cracks between copper base plate material and the ceramic. Experimental tests must be completed by numerical simulation tools in order to analyze this type of failure related to power cycling constraints. Thermal simulations of high power IGBT modules based on boundary element method are described in this paper. A validation of the numerical tool is shown in steady-state and dynamic operations during a power cycle by comparison with experimental measurements. Finally, using the software, a model of solder layer cracks between copper base plate and the DCB ceramic is applied in order to investigate its effect on the thermal constraints.
KW - Boundary element method
KW - IGBT modules
KW - Power cycling
KW - Thermal analysis
KW - Thermal modeling
KW - Thermal resistance
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UR - http://www.scopus.com/inward/citedby.url?scp=0034447197&partnerID=8YFLogxK
M3 - Paper
AN - SCOPUS:0034447197
SP - 271
EP - 274
ER -