The properties of Cu films deposited by high rate magnetron sputtering from a liquid target

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Abstract

The focus of the paper is Cu films obtained by magnetron sputtering a liquid target at an average power density not exceeding 45 W/cm2. The deposition rates reached 140 nm/s. In the film formation, the pulsed power supplies of two types have been used. The discharge has functioned in an Ar atmosphere and in self-sustained mode. Structural and electrically conductive properties of the films have been analyzed. A comparison was made with those deposited by sputtering a cooled target with similar power. It has revealed that the evaporation of the magnetron target plays a dominant role in the formation of the structural and conductive properties of Cu films. The Cu films deposited by sputtering evaporative liquid targets have a lower electrical resistance than the films of similar thickness obtained by sputtering cooled targets. The mode of self-sustained sputtering does not significantly affect the structural properties of the films as compared with sputtering in the Ar atmosphere, but the electrical resistivity is approximately 20% lower. Due to high deposition rate in the case with evaporative targets the heating of the substrate when producing films of equal thickness turns out to be less than when using a magnetron with a cooled target.

Original languageEnglish
Article number108914
JournalVacuum
Volume169
DOIs
Publication statusPublished - 1 Nov 2019

Fingerprint

Magnetron sputtering
magnetron sputtering
Sputtering
Liquids
liquids
sputtering
Deposition rates
atmospheres
Acoustic impedance
electrical resistance
power supplies
radiant flux density
Structural properties
Evaporation
evaporation
Heating
electrical resistivity
heating
Substrates

Keywords

  • Cu films and coatings
  • Cu films electrical resistance
  • Evaporation
  • Liquid-phase sputtering
  • Magnetron sputtering systems
  • Self-sustained sputtering

ASJC Scopus subject areas

  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films

Cite this

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title = "The properties of Cu films deposited by high rate magnetron sputtering from a liquid target",
abstract = "The focus of the paper is Cu films obtained by magnetron sputtering a liquid target at an average power density not exceeding 45 W/cm2. The deposition rates reached 140 nm/s. In the film formation, the pulsed power supplies of two types have been used. The discharge has functioned in an Ar atmosphere and in self-sustained mode. Structural and electrically conductive properties of the films have been analyzed. A comparison was made with those deposited by sputtering a cooled target with similar power. It has revealed that the evaporation of the magnetron target plays a dominant role in the formation of the structural and conductive properties of Cu films. The Cu films deposited by sputtering evaporative liquid targets have a lower electrical resistance than the films of similar thickness obtained by sputtering cooled targets. The mode of self-sustained sputtering does not significantly affect the structural properties of the films as compared with sputtering in the Ar atmosphere, but the electrical resistivity is approximately 20{\%} lower. Due to high deposition rate in the case with evaporative targets the heating of the substrate when producing films of equal thickness turns out to be less than when using a magnetron with a cooled target.",
keywords = "Cu films and coatings, Cu films electrical resistance, Evaporation, Liquid-phase sputtering, Magnetron sputtering systems, Self-sustained sputtering",
author = "Bleykher, {G. A.} and Yuryeva, {A. V.} and Shabunin, {A. S.} and Sidelev, {D. V.} and Grudinin, {V. A.} and Yuryev, {Yu N.}",
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AU - Bleykher, G. A.

AU - Yuryeva, A. V.

AU - Shabunin, A. S.

AU - Sidelev, D. V.

AU - Grudinin, V. A.

AU - Yuryev, Yu N.

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N2 - The focus of the paper is Cu films obtained by magnetron sputtering a liquid target at an average power density not exceeding 45 W/cm2. The deposition rates reached 140 nm/s. In the film formation, the pulsed power supplies of two types have been used. The discharge has functioned in an Ar atmosphere and in self-sustained mode. Structural and electrically conductive properties of the films have been analyzed. A comparison was made with those deposited by sputtering a cooled target with similar power. It has revealed that the evaporation of the magnetron target plays a dominant role in the formation of the structural and conductive properties of Cu films. The Cu films deposited by sputtering evaporative liquid targets have a lower electrical resistance than the films of similar thickness obtained by sputtering cooled targets. The mode of self-sustained sputtering does not significantly affect the structural properties of the films as compared with sputtering in the Ar atmosphere, but the electrical resistivity is approximately 20% lower. Due to high deposition rate in the case with evaporative targets the heating of the substrate when producing films of equal thickness turns out to be less than when using a magnetron with a cooled target.

AB - The focus of the paper is Cu films obtained by magnetron sputtering a liquid target at an average power density not exceeding 45 W/cm2. The deposition rates reached 140 nm/s. In the film formation, the pulsed power supplies of two types have been used. The discharge has functioned in an Ar atmosphere and in self-sustained mode. Structural and electrically conductive properties of the films have been analyzed. A comparison was made with those deposited by sputtering a cooled target with similar power. It has revealed that the evaporation of the magnetron target plays a dominant role in the formation of the structural and conductive properties of Cu films. The Cu films deposited by sputtering evaporative liquid targets have a lower electrical resistance than the films of similar thickness obtained by sputtering cooled targets. The mode of self-sustained sputtering does not significantly affect the structural properties of the films as compared with sputtering in the Ar atmosphere, but the electrical resistivity is approximately 20% lower. Due to high deposition rate in the case with evaporative targets the heating of the substrate when producing films of equal thickness turns out to be less than when using a magnetron with a cooled target.

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KW - Magnetron sputtering systems

KW - Self-sustained sputtering

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