The properties of Cu films deposited by high rate magnetron sputtering from a liquid target

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Abstract

The focus of the paper is Cu films obtained by magnetron sputtering a liquid target at an average power density not exceeding 45 W/cm2. The deposition rates reached 140 nm/s. In the film formation, the pulsed power supplies of two types have been used. The discharge has functioned in an Ar atmosphere and in self-sustained mode. Structural and electrically conductive properties of the films have been analyzed. A comparison was made with those deposited by sputtering a cooled target with similar power. It has revealed that the evaporation of the magnetron target plays a dominant role in the formation of the structural and conductive properties of Cu films. The Cu films deposited by sputtering evaporative liquid targets have a lower electrical resistance than the films of similar thickness obtained by sputtering cooled targets. The mode of self-sustained sputtering does not significantly affect the structural properties of the films as compared with sputtering in the Ar atmosphere, but the electrical resistivity is approximately 20% lower. Due to high deposition rate in the case with evaporative targets the heating of the substrate when producing films of equal thickness turns out to be less than when using a magnetron with a cooled target.

Original languageEnglish
Article number108914
JournalVacuum
Volume169
DOIs
Publication statusPublished - 1 Nov 2019

Keywords

  • Cu films and coatings
  • Cu films electrical resistance
  • Evaporation
  • Liquid-phase sputtering
  • Magnetron sputtering systems
  • Self-sustained sputtering

ASJC Scopus subject areas

  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films

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