The peculiarities of modeling reliability parameters for printed circuit assembly electronics working in cycling mode

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Abstract

Temperature fields of typical printed circuit assembly electronics working in cycling mode were numerically analyzed taking into account convection and radiation heat transfer with the external environment. The data obtained show the necessary to use real temperature values in the problems of defining the reliability parameters of the device working in cycling mode with Jong intervals of interruption.

Original languageEnglish
Pages (from-to)19-22
Number of pages4
JournalElektromagnitnye Volny i Elektronnye Systemy
Volume10
Issue number11-12
Publication statusPublished - 2005

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ASJC Scopus subject areas

  • Radiation
  • Electrical and Electronic Engineering

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