The peculiarities of modeling reliability parameters for printed circuit assembly electronics working in cycling mode

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9 Citations (Scopus)

Abstract

Temperature fields of typical printed circuit assembly electronics working in cycling mode were numerically analyzed taking into account convection and radiation heat transfer with the external environment. The data obtained show the necessary to use real temperature values in the problems of defining the reliability parameters of the device working in cycling mode with Jong intervals of interruption.

Original languageEnglish
Pages (from-to)19-22
Number of pages4
JournalElektromagnitnye Volny i Elektronnye Systemy
Volume10
Issue number11-12
Publication statusPublished - 2005

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Heat convection
Printed circuits
Heat radiation
printed circuits
Temperature distribution
Electronic equipment
assembly
cycles
interruption
electronics
temperature distribution
convection
heat transfer
intervals
Temperature
radiation
temperature

ASJC Scopus subject areas

  • Radiation
  • Electrical and Electronic Engineering

Cite this

@article{5851bf013a4d46c0b2b5c0060973fc1d,
title = "The peculiarities of modeling reliability parameters for printed circuit assembly electronics working in cycling mode",
abstract = "Temperature fields of typical printed circuit assembly electronics working in cycling mode were numerically analyzed taking into account convection and radiation heat transfer with the external environment. The data obtained show the necessary to use real temperature values in the problems of defining the reliability parameters of the device working in cycling mode with Jong intervals of interruption.",
author = "Kuznetsov, {G. V.} and Kravchenko, {Evgeniy Vladimirovich}",
year = "2005",
language = "English",
volume = "10",
pages = "19--22",
journal = "Elektromagnitnye Volny i Elektronnye Systemy",
issn = "1560-4128",
publisher = "Izdatel'stvo Radiotekhnika",
number = "11-12",

}

TY - JOUR

T1 - The peculiarities of modeling reliability parameters for printed circuit assembly electronics working in cycling mode

AU - Kuznetsov, G. V.

AU - Kravchenko, Evgeniy Vladimirovich

PY - 2005

Y1 - 2005

N2 - Temperature fields of typical printed circuit assembly electronics working in cycling mode were numerically analyzed taking into account convection and radiation heat transfer with the external environment. The data obtained show the necessary to use real temperature values in the problems of defining the reliability parameters of the device working in cycling mode with Jong intervals of interruption.

AB - Temperature fields of typical printed circuit assembly electronics working in cycling mode were numerically analyzed taking into account convection and radiation heat transfer with the external environment. The data obtained show the necessary to use real temperature values in the problems of defining the reliability parameters of the device working in cycling mode with Jong intervals of interruption.

UR - http://www.scopus.com/inward/record.url?scp=33644897825&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33644897825&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:33644897825

VL - 10

SP - 19

EP - 22

JO - Elektromagnitnye Volny i Elektronnye Systemy

JF - Elektromagnitnye Volny i Elektronnye Systemy

SN - 1560-4128

IS - 11-12

ER -