The effect of substrate wettability on the breakdown of a locally heated fluid film

D. V. Zaitsev, D. P. Kirichenko, O. A. Kabov

Research output: Contribution to journalArticle

29 Citations (Scopus)

Abstract

The effect of the equilibrium contact angle of wetting on the dynamics of the dry patch propagation and on the critical heat flux upon the breakdown of a water film that is heated locally from the substrate side is studied experimentally. The equilibrium contact angle is varied from 27° ± 6° to 74° ± 9° (with no changes in the thermophysical properties of the system) through the use of different types of surface grinding. The studies are performed for three flow modes: (a) a fluid film that freely flows down along a substrate with an inclination of 5° to the horizon, (b) a film that moves along a horizontal substrate under the influence of hydrostatic pressure, and (c) a static film on a horizontal substrate. It is found that the substrate wettability has a significant effect on the dry patch propagation rate and its final size in all these cases, but has almost no effect on the threshold heat flux at which the breakdown of a film occurs.

Original languageEnglish
Pages (from-to)551-553
Number of pages3
JournalTechnical Physics Letters
Volume41
Issue number6
DOIs
Publication statusPublished - 28 Jun 2015

Fingerprint

fluid films
wettability
breakdown
heat flux
propagation
thermophysical properties
grinding
hydrostatic pressure
wetting
inclination
horizon
thresholds
water

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

The effect of substrate wettability on the breakdown of a locally heated fluid film. / Zaitsev, D. V.; Kirichenko, D. P.; Kabov, O. A.

In: Technical Physics Letters, Vol. 41, No. 6, 28.06.2015, p. 551-553.

Research output: Contribution to journalArticle

@article{0c06fb9bb5554220a1cf331c2dd1c4ab,
title = "The effect of substrate wettability on the breakdown of a locally heated fluid film",
abstract = "The effect of the equilibrium contact angle of wetting on the dynamics of the dry patch propagation and on the critical heat flux upon the breakdown of a water film that is heated locally from the substrate side is studied experimentally. The equilibrium contact angle is varied from 27° ± 6° to 74° ± 9° (with no changes in the thermophysical properties of the system) through the use of different types of surface grinding. The studies are performed for three flow modes: (a) a fluid film that freely flows down along a substrate with an inclination of 5° to the horizon, (b) a film that moves along a horizontal substrate under the influence of hydrostatic pressure, and (c) a static film on a horizontal substrate. It is found that the substrate wettability has a significant effect on the dry patch propagation rate and its final size in all these cases, but has almost no effect on the threshold heat flux at which the breakdown of a film occurs.",
author = "Zaitsev, {D. V.} and Kirichenko, {D. P.} and Kabov, {O. A.}",
year = "2015",
month = "6",
day = "28",
doi = "10.1134/S1063785015060140",
language = "English",
volume = "41",
pages = "551--553",
journal = "Technical Physics Letters",
issn = "1063-7850",
publisher = "Maik Nauka-Interperiodica Publishing",
number = "6",

}

TY - JOUR

T1 - The effect of substrate wettability on the breakdown of a locally heated fluid film

AU - Zaitsev, D. V.

AU - Kirichenko, D. P.

AU - Kabov, O. A.

PY - 2015/6/28

Y1 - 2015/6/28

N2 - The effect of the equilibrium contact angle of wetting on the dynamics of the dry patch propagation and on the critical heat flux upon the breakdown of a water film that is heated locally from the substrate side is studied experimentally. The equilibrium contact angle is varied from 27° ± 6° to 74° ± 9° (with no changes in the thermophysical properties of the system) through the use of different types of surface grinding. The studies are performed for three flow modes: (a) a fluid film that freely flows down along a substrate with an inclination of 5° to the horizon, (b) a film that moves along a horizontal substrate under the influence of hydrostatic pressure, and (c) a static film on a horizontal substrate. It is found that the substrate wettability has a significant effect on the dry patch propagation rate and its final size in all these cases, but has almost no effect on the threshold heat flux at which the breakdown of a film occurs.

AB - The effect of the equilibrium contact angle of wetting on the dynamics of the dry patch propagation and on the critical heat flux upon the breakdown of a water film that is heated locally from the substrate side is studied experimentally. The equilibrium contact angle is varied from 27° ± 6° to 74° ± 9° (with no changes in the thermophysical properties of the system) through the use of different types of surface grinding. The studies are performed for three flow modes: (a) a fluid film that freely flows down along a substrate with an inclination of 5° to the horizon, (b) a film that moves along a horizontal substrate under the influence of hydrostatic pressure, and (c) a static film on a horizontal substrate. It is found that the substrate wettability has a significant effect on the dry patch propagation rate and its final size in all these cases, but has almost no effect on the threshold heat flux at which the breakdown of a film occurs.

UR - http://www.scopus.com/inward/record.url?scp=84938087111&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84938087111&partnerID=8YFLogxK

U2 - 10.1134/S1063785015060140

DO - 10.1134/S1063785015060140

M3 - Article

AN - SCOPUS:84938087111

VL - 41

SP - 551

EP - 553

JO - Technical Physics Letters

JF - Technical Physics Letters

SN - 1063-7850

IS - 6

ER -