The effect of layer-by-layer laser sintering on the quality of copper powder sintered surface layer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Technologies of layer-by-layer laser sintering allow of manufacturing powdered material products on the base of a 3D-CAD model. Since a product is based on a single layer it is very important to assign appropriate technological conditions of sintering and reveal their effect on synthesizing a single sintered layer of certain thickness and roughness. The authors propose mathematical models for the influence of laser output, speed of laser beam displacement, scanning pitch and temperature of powdered material pre-heating on roughness and thickness of a single layer sintered of PMS-1 copper powder.

Original languageEnglish
Title of host publicationProceedings - 2016 11th International Forum on Strategic Technology, IFOST 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages244-246
Number of pages3
ISBN (Electronic)9781509008551
DOIs
Publication statusPublished - 21 Mar 2017
Event11th International Forum on Strategic Technology, IFOST 2016 - Novosibirsk, Russian Federation
Duration: 1 Jun 20163 Jun 2016

Conference

Conference11th International Forum on Strategic Technology, IFOST 2016
CountryRussian Federation
CityNovosibirsk
Period1.6.163.6.16

Keywords

  • experimental assembly
  • layer-by-layer laser sintering
  • sintering conditions
  • surface layer quality

ASJC Scopus subject areas

  • Ceramics and Composites
  • Computational Mathematics
  • Computer Science Applications
  • Mechanical Engineering
  • Mechanics of Materials
  • Electronic, Optical and Magnetic Materials
  • Control and Optimization

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  • Cite this

    Saprykin, A. A., Saprykina, N. A., & Arkhipova, D. A. (2017). The effect of layer-by-layer laser sintering on the quality of copper powder sintered surface layer. In Proceedings - 2016 11th International Forum on Strategic Technology, IFOST 2016 (pp. 244-246). [7884096] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IFOST.2016.7884096