The effect of fluence on the penetration depth of titanium into the copper substrate under ion treatment

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The results of investigation of the surface of a copper substrate modified with titanium ions are presented. Using TEM it has been established that a multi-level micro- and nanoporous nanocrystalline structure is formed due to simultaneous ion etching, heating, radiation-stimulated diffusion in the surface layer of the metal substrate. When bombarded with titanium ions the intermetallic phases of the equilibrium diagram of the Cu-Ti are formed. The penetration depth of titanium into the copper substrate under ion treatment has investigated in detail. It has been found that the phase composition and the surface morphology are dependent on fluence of the ion treatment.

Original languageEnglish
Title of host publicationProceedings of the International Conference on Physical Mesomechanics. Materials with Multilevel Hierarchical Structure and Intelligent Manufacturing Technology
EditorsVictor E. Panin, Vasily M. Fomin
PublisherAmerican Institute of Physics Inc.
ISBN (Electronic)9780735440463
DOIs
Publication statusPublished - 14 Dec 2020
EventInternational Conference on Physical Mesomechanics. Materials with Multilevel Hierarchical Structure and Intelligent Manufacturing Technology 2020 - Tomsk, Russian Federation
Duration: 5 Oct 20209 Oct 2020

Publication series

NameAIP Conference Proceedings
Volume2310
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Conference

ConferenceInternational Conference on Physical Mesomechanics. Materials with Multilevel Hierarchical Structure and Intelligent Manufacturing Technology 2020
CountryRussian Federation
CityTomsk
Period5.10.209.10.20

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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