The effect of contact angle on dynamics of dry spots spreading in a horizontal layer of liquid at local heating

D. V. Zaitsev, D. P. Kirichenko, E. V. Orlik, O. A. Kabov

Research output: Contribution to journalArticle

Abstract

The effect of equilibrium contact angle on dynamics of dry spot spreading at disruption of a horizontal water layer heated locally from the substrate was studied using the high-speed Schlieren technique. Different methods of working surface processing were applied; this allowed variations of the equilibrium contact angle from 27±6° to 74±9° without a change in thermal properties of the system. It is found out that substrate wettability significantly affects the propagation velocity of dry spot and its final size. It is also found out that the velocity of contact line propagation is higher in the areas of substrate with a higher temperature.

Original languageEnglish
Article number01063
JournalMATEC Web of Conferences
Volume37
DOIs
Publication statusPublished - 22 Dec 2015

Fingerprint

Contact angle
Heating
Liquids
Substrates
Wetting
Thermodynamic properties
Water
Processing
Temperature

ASJC Scopus subject areas

  • Chemistry(all)
  • Engineering(all)
  • Materials Science(all)

Cite this

The effect of contact angle on dynamics of dry spots spreading in a horizontal layer of liquid at local heating. / Zaitsev, D. V.; Kirichenko, D. P.; Orlik, E. V.; Kabov, O. A.

In: MATEC Web of Conferences, Vol. 37, 01063, 22.12.2015.

Research output: Contribution to journalArticle

@article{83016b7a35c4480a99efd1b19c9cbf53,
title = "The effect of contact angle on dynamics of dry spots spreading in a horizontal layer of liquid at local heating",
abstract = "The effect of equilibrium contact angle on dynamics of dry spot spreading at disruption of a horizontal water layer heated locally from the substrate was studied using the high-speed Schlieren technique. Different methods of working surface processing were applied; this allowed variations of the equilibrium contact angle from 27±6° to 74±9° without a change in thermal properties of the system. It is found out that substrate wettability significantly affects the propagation velocity of dry spot and its final size. It is also found out that the velocity of contact line propagation is higher in the areas of substrate with a higher temperature.",
author = "Zaitsev, {D. V.} and Kirichenko, {D. P.} and Orlik, {E. V.} and Kabov, {O. A.}",
year = "2015",
month = "12",
day = "22",
doi = "10.1051/matecconf/20153701063",
language = "English",
volume = "37",
journal = "MATEC Web of Conferences",

}

TY - JOUR

T1 - The effect of contact angle on dynamics of dry spots spreading in a horizontal layer of liquid at local heating

AU - Zaitsev, D. V.

AU - Kirichenko, D. P.

AU - Orlik, E. V.

AU - Kabov, O. A.

PY - 2015/12/22

Y1 - 2015/12/22

N2 - The effect of equilibrium contact angle on dynamics of dry spot spreading at disruption of a horizontal water layer heated locally from the substrate was studied using the high-speed Schlieren technique. Different methods of working surface processing were applied; this allowed variations of the equilibrium contact angle from 27±6° to 74±9° without a change in thermal properties of the system. It is found out that substrate wettability significantly affects the propagation velocity of dry spot and its final size. It is also found out that the velocity of contact line propagation is higher in the areas of substrate with a higher temperature.

AB - The effect of equilibrium contact angle on dynamics of dry spot spreading at disruption of a horizontal water layer heated locally from the substrate was studied using the high-speed Schlieren technique. Different methods of working surface processing were applied; this allowed variations of the equilibrium contact angle from 27±6° to 74±9° without a change in thermal properties of the system. It is found out that substrate wettability significantly affects the propagation velocity of dry spot and its final size. It is also found out that the velocity of contact line propagation is higher in the areas of substrate with a higher temperature.

UR - http://www.scopus.com/inward/record.url?scp=84976497720&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84976497720&partnerID=8YFLogxK

U2 - 10.1051/matecconf/20153701063

DO - 10.1051/matecconf/20153701063

M3 - Article

VL - 37

JO - MATEC Web of Conferences

JF - MATEC Web of Conferences

M1 - 01063

ER -