Abstract
Polycrystalline diamond films were fabricated on copper substrates by a multi-step process comprised of physical vapor deposition of Al-based composite interlayer on Cu substrate and depositing continuous diamond film on composite interlayer by plasma assisted chemical vapor deposition (PACVD). The interface characteristics and adhesion strength were investigated by Auger electron spectroscopy, Raman analysis, calotest and indentation test. The results show that the continuous film without cracks is successfully obtained. The improved adhesion between diamond film and substrate results from the low residual stress in the film due to their compensation by Al interlayer in the sample cooling process.
| Original language | English |
|---|---|
| Article number | 012102 |
| Journal | Journal of Physics: Conference Series |
| Volume | 830 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 4 May 2017 |
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ASJC Scopus subject areas
- Physics and Astronomy(all)
Cite this
The dynamic sublayers for improving the adhesion of CVD diamond films on copper. / Gaydaychuk, A. V.; Linnik, S. A.; Okhotnikov, V. V.
In: Journal of Physics: Conference Series, Vol. 830, No. 1, 012102, 04.05.2017.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - The dynamic sublayers for improving the adhesion of CVD diamond films on copper
AU - Gaydaychuk, A. V.
AU - Linnik, S. A.
AU - Okhotnikov, V. V.
PY - 2017/5/4
Y1 - 2017/5/4
N2 - Polycrystalline diamond films were fabricated on copper substrates by a multi-step process comprised of physical vapor deposition of Al-based composite interlayer on Cu substrate and depositing continuous diamond film on composite interlayer by plasma assisted chemical vapor deposition (PACVD). The interface characteristics and adhesion strength were investigated by Auger electron spectroscopy, Raman analysis, calotest and indentation test. The results show that the continuous film without cracks is successfully obtained. The improved adhesion between diamond film and substrate results from the low residual stress in the film due to their compensation by Al interlayer in the sample cooling process.
AB - Polycrystalline diamond films were fabricated on copper substrates by a multi-step process comprised of physical vapor deposition of Al-based composite interlayer on Cu substrate and depositing continuous diamond film on composite interlayer by plasma assisted chemical vapor deposition (PACVD). The interface characteristics and adhesion strength were investigated by Auger electron spectroscopy, Raman analysis, calotest and indentation test. The results show that the continuous film without cracks is successfully obtained. The improved adhesion between diamond film and substrate results from the low residual stress in the film due to their compensation by Al interlayer in the sample cooling process.
UR - http://www.scopus.com/inward/record.url?scp=85020039097&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85020039097&partnerID=8YFLogxK
U2 - 10.1088/1742-6596/830/1/012102
DO - 10.1088/1742-6596/830/1/012102
M3 - Article
AN - SCOPUS:85020039097
VL - 830
JO - Journal of Physics: Conference Series
JF - Journal of Physics: Conference Series
SN - 1742-6588
IS - 1
M1 - 012102
ER -