The additives influence on heat-conducting properties of aluminium nitride circuit boards

A. S. Karakulov, N. V. Gusev, Yu Yu Drozdov, N. Y. Nikonova

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The paper presents the studies on evaluation of the influence of modified additives of Y2O3-, ZrO2- and Li2O3-type on heat-conductive properties of aluminium-nitride ceramics used as circuit boards. Sintering of the studied samples was carried out using AlN powders and the powders of the modifying additives, mixed in the ball mill based on the spark plasma sintering system "SPS". Density and heat conductivity were measured for the obtained samples. It was ascertained that the most significant level of heat conductivity was obtained when using the additive mixture made of 7 wt. % of Li2O3 and 3wt. % of Y2O3, which reaches the level of 160 W/m·K. In addition, the results of the studies show that the addition of the modified powders leads to a significant increase of density; the additive consisting of 7wt.% of Li2O3 and 3wt.% of Y2O3 produces the greatest effect.

Original languageEnglish
Title of host publicationAdvanced Materials for Technical and Medical Purpose
EditorsGeorgiy Osokin, Gennady E. Remnev, Sergey Psakhie, Valeriy Pogrebenkov, Nikolay Ratakhin
PublisherTrans Tech Publications Ltd
Pages226-231
Number of pages6
ISBN (Print)9783035710649
DOIs
Publication statusPublished - 1 Jan 2016
EventWorkshop on Advanced Materials for Technical and Medical Purpose, AMTMP-2016 - Tomsk, Russian Federation
Duration: 15 Feb 201617 Feb 2016

Publication series

NameKey Engineering Materials
Volume712
ISSN (Print)1013-9826

Conference

ConferenceWorkshop on Advanced Materials for Technical and Medical Purpose, AMTMP-2016
CountryRussian Federation
CityTomsk
Period15.2.1617.2.16

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Keywords

  • Aluminium-nitride ceramics
  • Heat-conductive properties
  • Modifying additives
  • Spark plasma sintering
  • Substrates

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Karakulov, A. S., Gusev, N. V., Drozdov, Y. Y., & Nikonova, N. Y. (2016). The additives influence on heat-conducting properties of aluminium nitride circuit boards. In G. Osokin, G. E. Remnev, S. Psakhie, V. Pogrebenkov, & N. Ratakhin (Eds.), Advanced Materials for Technical and Medical Purpose (pp. 226-231). (Key Engineering Materials; Vol. 712). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/KEM.712.226