Abstract
The paper presents the effect of temperature amplitude and dwells level on the thermomechanical behaviour of power modules solder. Especially, we show the influence of these parameters on the crack initiation and propagation in the solder layer between Direct Bond Copper and base plate of high power IGBT modules. For this purpose, thermal cycling tests have been performed on IGBT power modules with three temperature profiles. For cycle#1 temperature vary between -40°C and 120°C, cycle#2 temperature vary from 40°C to 120°C and for cycle#3 temperature vary from -40°C to 40°C. These tests revealed that solder crack initiation and its propagation occur earlier for cycle#1 where temperature variation is higher. But the unexpected results concern those of cycle#2 and cycle#3. In spite of the fact that its have the same temperature variations, solder crack initiations occur earlier and propagate faster in cycle#2 than in cycle#3 . These results show clearly that high and low temperature levels are important on solder lifetime. In order to understand the experimental results, FE simulations have been performed (with ANSYS). The first obtained results show that stress variation depends on the low temperature level, lower is Tmin higher is stress variation. On the other hand, strain variation depends on high temperature level, higher is Tmax higher is strain variation. Finally, Complementary simulations with various high and low temperatures have been performed and revealed tow mechanical behaviour of the solder. When upper temperature is below a homologous temperature of 0.74Tm, shear strain variations remains in a relatively small range and shear stress variations have a linear dependence with the temperature variation. On the contrary, when Tmax is above 0.74 Tm, shear stresses variations reach a saturation value while inelastic shear strains increase significantly.
| Original language | English |
|---|---|
| Title of host publication | PESC '08 - 39th IEEE Annual Power Electronics Specialists Conference - Proceedings |
| Pages | 2435-2440 |
| Number of pages | 6 |
| DOIs | |
| Publication status | Published - 29 Sep 2008 |
| Externally published | Yes |
| Event | PESC '08 - 39th IEEE Annual Power Electronics Specialists Conference - Rhodes, Greece Duration: 15 Jun 2008 → 19 Jun 2008 |
Publication series
| Name | PESC Record - IEEE Annual Power Electronics Specialists Conference |
|---|---|
| ISSN (Print) | 0275-9306 |
Conference
| Conference | PESC '08 - 39th IEEE Annual Power Electronics Specialists Conference |
|---|---|
| Country | Greece |
| City | Rhodes |
| Period | 15.6.08 → 19.6.08 |
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Keywords
- Finite element analysis (FEA)
- IGBT
- Packaging
- Power electronic modules
- Thermal cycling tests
ASJC Scopus subject areas
- Modelling and Simulation
- Condensed Matter Physics
- Energy Engineering and Power Technology
- Electrical and Electronic Engineering
Cite this
Temperature levels effects on the thermo-mechanical behaviour of solder attach during thermal cycling of power electronic modules. / Bouarroudj, M.; Khatir, Z.; Lefebvre, S.
PESC '08 - 39th IEEE Annual Power Electronics Specialists Conference - Proceedings. 2008. p. 2435-2440 4592306 (PESC Record - IEEE Annual Power Electronics Specialists Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Temperature levels effects on the thermo-mechanical behaviour of solder attach during thermal cycling of power electronic modules
AU - Bouarroudj, M.
AU - Khatir, Z.
AU - Lefebvre, S.
PY - 2008/9/29
Y1 - 2008/9/29
N2 - The paper presents the effect of temperature amplitude and dwells level on the thermomechanical behaviour of power modules solder. Especially, we show the influence of these parameters on the crack initiation and propagation in the solder layer between Direct Bond Copper and base plate of high power IGBT modules. For this purpose, thermal cycling tests have been performed on IGBT power modules with three temperature profiles. For cycle#1 temperature vary between -40°C and 120°C, cycle#2 temperature vary from 40°C to 120°C and for cycle#3 temperature vary from -40°C to 40°C. These tests revealed that solder crack initiation and its propagation occur earlier for cycle#1 where temperature variation is higher. But the unexpected results concern those of cycle#2 and cycle#3. In spite of the fact that its have the same temperature variations, solder crack initiations occur earlier and propagate faster in cycle#2 than in cycle#3 . These results show clearly that high and low temperature levels are important on solder lifetime. In order to understand the experimental results, FE simulations have been performed (with ANSYS). The first obtained results show that stress variation depends on the low temperature level, lower is Tmin higher is stress variation. On the other hand, strain variation depends on high temperature level, higher is Tmax higher is strain variation. Finally, Complementary simulations with various high and low temperatures have been performed and revealed tow mechanical behaviour of the solder. When upper temperature is below a homologous temperature of 0.74Tm, shear strain variations remains in a relatively small range and shear stress variations have a linear dependence with the temperature variation. On the contrary, when Tmax is above 0.74 Tm, shear stresses variations reach a saturation value while inelastic shear strains increase significantly.
AB - The paper presents the effect of temperature amplitude and dwells level on the thermomechanical behaviour of power modules solder. Especially, we show the influence of these parameters on the crack initiation and propagation in the solder layer between Direct Bond Copper and base plate of high power IGBT modules. For this purpose, thermal cycling tests have been performed on IGBT power modules with three temperature profiles. For cycle#1 temperature vary between -40°C and 120°C, cycle#2 temperature vary from 40°C to 120°C and for cycle#3 temperature vary from -40°C to 40°C. These tests revealed that solder crack initiation and its propagation occur earlier for cycle#1 where temperature variation is higher. But the unexpected results concern those of cycle#2 and cycle#3. In spite of the fact that its have the same temperature variations, solder crack initiations occur earlier and propagate faster in cycle#2 than in cycle#3 . These results show clearly that high and low temperature levels are important on solder lifetime. In order to understand the experimental results, FE simulations have been performed (with ANSYS). The first obtained results show that stress variation depends on the low temperature level, lower is Tmin higher is stress variation. On the other hand, strain variation depends on high temperature level, higher is Tmax higher is strain variation. Finally, Complementary simulations with various high and low temperatures have been performed and revealed tow mechanical behaviour of the solder. When upper temperature is below a homologous temperature of 0.74Tm, shear strain variations remains in a relatively small range and shear stress variations have a linear dependence with the temperature variation. On the contrary, when Tmax is above 0.74 Tm, shear stresses variations reach a saturation value while inelastic shear strains increase significantly.
KW - Finite element analysis (FEA)
KW - IGBT
KW - Packaging
KW - Power electronic modules
KW - Thermal cycling tests
UR - http://www.scopus.com/inward/record.url?scp=52349105406&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=52349105406&partnerID=8YFLogxK
U2 - 10.1109/PESC.2008.4592306
DO - 10.1109/PESC.2008.4592306
M3 - Conference contribution
SN - 9781424416684
T3 - PESC Record - IEEE Annual Power Electronics Specialists Conference
SP - 2435
EP - 2440
BT - PESC '08 - 39th IEEE Annual Power Electronics Specialists Conference - Proceedings
ER -