Temperature levels effects on the thermo-mechanical behaviour of solder attach during thermal cycling of power electronic modules

M. Bouarroudj, Z. Khatir, S. Lefebvre

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

The paper presents the effect of temperature amplitude and dwells level on the thermomechanical behaviour of power modules solder. Especially, we show the influence of these parameters on the crack initiation and propagation in the solder layer between Direct Bond Copper and base plate of high power IGBT modules. For this purpose, thermal cycling tests have been performed on IGBT power modules with three temperature profiles. For cycle#1 temperature vary between -40°C and 120°C, cycle#2 temperature vary from 40°C to 120°C and for cycle#3 temperature vary from -40°C to 40°C. These tests revealed that solder crack initiation and its propagation occur earlier for cycle#1 where temperature variation is higher. But the unexpected results concern those of cycle#2 and cycle#3. In spite of the fact that its have the same temperature variations, solder crack initiations occur earlier and propagate faster in cycle#2 than in cycle#3 . These results show clearly that high and low temperature levels are important on solder lifetime. In order to understand the experimental results, FE simulations have been performed (with ANSYS). The first obtained results show that stress variation depends on the low temperature level, lower is Tmin higher is stress variation. On the other hand, strain variation depends on high temperature level, higher is Tmax higher is strain variation. Finally, Complementary simulations with various high and low temperatures have been performed and revealed tow mechanical behaviour of the solder. When upper temperature is below a homologous temperature of 0.74Tm, shear strain variations remains in a relatively small range and shear stress variations have a linear dependence with the temperature variation. On the contrary, when Tmax is above 0.74 Tm, shear stresses variations reach a saturation value while inelastic shear strains increase significantly.

Original languageEnglish
Title of host publicationPESC '08 - 39th IEEE Annual Power Electronics Specialists Conference - Proceedings
Pages2435-2440
Number of pages6
DOIs
Publication statusPublished - 29 Sep 2008
Externally publishedYes
EventPESC '08 - 39th IEEE Annual Power Electronics Specialists Conference - Rhodes, Greece
Duration: 15 Jun 200819 Jun 2008

Publication series

NamePESC Record - IEEE Annual Power Electronics Specialists Conference
ISSN (Print)0275-9306

Conference

ConferencePESC '08 - 39th IEEE Annual Power Electronics Specialists Conference
CountryGreece
CityRhodes
Period15.6.0819.6.08

Fingerprint

electronic modules
Power Electronics
Cycling
Thermal cycling
Mechanical Behavior
solders
Power electronics
Soldering alloys
Module
cycles
Cycle
Crack Initiation
crack initiation
Temperature
temperature
shear strain
Vary
Crack initiation
Shear Stress
shear stress

Keywords

  • Finite element analysis (FEA)
  • IGBT
  • Packaging
  • Power electronic modules
  • Thermal cycling tests

ASJC Scopus subject areas

  • Modelling and Simulation
  • Condensed Matter Physics
  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

Cite this

Bouarroudj, M., Khatir, Z., & Lefebvre, S. (2008). Temperature levels effects on the thermo-mechanical behaviour of solder attach during thermal cycling of power electronic modules. In PESC '08 - 39th IEEE Annual Power Electronics Specialists Conference - Proceedings (pp. 2435-2440). [4592306] (PESC Record - IEEE Annual Power Electronics Specialists Conference). https://doi.org/10.1109/PESC.2008.4592306

Temperature levels effects on the thermo-mechanical behaviour of solder attach during thermal cycling of power electronic modules. / Bouarroudj, M.; Khatir, Z.; Lefebvre, S.

PESC '08 - 39th IEEE Annual Power Electronics Specialists Conference - Proceedings. 2008. p. 2435-2440 4592306 (PESC Record - IEEE Annual Power Electronics Specialists Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bouarroudj, M, Khatir, Z & Lefebvre, S 2008, Temperature levels effects on the thermo-mechanical behaviour of solder attach during thermal cycling of power electronic modules. in PESC '08 - 39th IEEE Annual Power Electronics Specialists Conference - Proceedings., 4592306, PESC Record - IEEE Annual Power Electronics Specialists Conference, pp. 2435-2440, PESC '08 - 39th IEEE Annual Power Electronics Specialists Conference, Rhodes, Greece, 15.6.08. https://doi.org/10.1109/PESC.2008.4592306
Bouarroudj M, Khatir Z, Lefebvre S. Temperature levels effects on the thermo-mechanical behaviour of solder attach during thermal cycling of power electronic modules. In PESC '08 - 39th IEEE Annual Power Electronics Specialists Conference - Proceedings. 2008. p. 2435-2440. 4592306. (PESC Record - IEEE Annual Power Electronics Specialists Conference). https://doi.org/10.1109/PESC.2008.4592306
Bouarroudj, M. ; Khatir, Z. ; Lefebvre, S. / Temperature levels effects on the thermo-mechanical behaviour of solder attach during thermal cycling of power electronic modules. PESC '08 - 39th IEEE Annual Power Electronics Specialists Conference - Proceedings. 2008. pp. 2435-2440 (PESC Record - IEEE Annual Power Electronics Specialists Conference).
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