Abstract
This paper presents the design and simulation of a microelectromechanical gyroscope that simultaneously determines two components of angular velocity. In this device, the silicon sensor is started by an electrostatic actuator to perform a linear harmonic motion at a controlled speed. The movable masses of the sensor move in two directions, orthogonal to the primary vibrations of the sensor under the action of Coriolis forces. This paper considers how temperature influences eigenfrequencies and informative vibrational magnitudes of the micromechanical angular velocity sensor. The parameters that have the greatest impact on the sensor output behavior are determined by a finite-element analysis method. Techniques to stabilize vibration eigenfrequencies of the sensing element are suggested.
| Original language | English |
|---|---|
| Article number | 6881628 |
| Pages (from-to) | 1598-1605 |
| Number of pages | 8 |
| Journal | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| Volume | 4 |
| Issue number | 10 |
| DOIs | |
| Publication status | Published - 1 Oct 2014 |
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Keywords
- Electrostatic actuators
- gyroscopes
- microelectromechanical devices
- temperature compensation
- vibrations
- vibrodrive
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Industrial and Manufacturing Engineering
Cite this
Temperature error compensation in two-component microelectromechanical gyroscope. / Nesterenko, Tamara G.; Koleda, Aleksei Nikolaevich; Barbin, Evgenii Sergeevich; Uchaikin, Sergey V.
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 4, No. 10, 6881628, 01.10.2014, p. 1598-1605.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Temperature error compensation in two-component microelectromechanical gyroscope
AU - Nesterenko, Tamara G.
AU - Koleda, Aleksei Nikolaevich
AU - Barbin, Evgenii Sergeevich
AU - Uchaikin, Sergey V.
PY - 2014/10/1
Y1 - 2014/10/1
N2 - This paper presents the design and simulation of a microelectromechanical gyroscope that simultaneously determines two components of angular velocity. In this device, the silicon sensor is started by an electrostatic actuator to perform a linear harmonic motion at a controlled speed. The movable masses of the sensor move in two directions, orthogonal to the primary vibrations of the sensor under the action of Coriolis forces. This paper considers how temperature influences eigenfrequencies and informative vibrational magnitudes of the micromechanical angular velocity sensor. The parameters that have the greatest impact on the sensor output behavior are determined by a finite-element analysis method. Techniques to stabilize vibration eigenfrequencies of the sensing element are suggested.
AB - This paper presents the design and simulation of a microelectromechanical gyroscope that simultaneously determines two components of angular velocity. In this device, the silicon sensor is started by an electrostatic actuator to perform a linear harmonic motion at a controlled speed. The movable masses of the sensor move in two directions, orthogonal to the primary vibrations of the sensor under the action of Coriolis forces. This paper considers how temperature influences eigenfrequencies and informative vibrational magnitudes of the micromechanical angular velocity sensor. The parameters that have the greatest impact on the sensor output behavior are determined by a finite-element analysis method. Techniques to stabilize vibration eigenfrequencies of the sensing element are suggested.
KW - Electrostatic actuators
KW - gyroscopes
KW - microelectromechanical devices
KW - temperature compensation
KW - vibrations
KW - vibrodrive
UR - http://www.scopus.com/inward/record.url?scp=84907763599&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84907763599&partnerID=8YFLogxK
U2 - 10.1109/TCPMT.2014.2327958
DO - 10.1109/TCPMT.2014.2327958
M3 - Article
VL - 4
SP - 1598
EP - 1605
JO - IEEE Transactions on Components, Packaging and Manufacturing Technology
JF - IEEE Transactions on Components, Packaging and Manufacturing Technology
SN - 2156-3950
IS - 10
M1 - 6881628
ER -