Tangential cathode magnetic field and substrate bias influence on copper vacuum arc macroparticle content decreasing

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4 Citations (Scopus)

Abstract

The paper presents the results of an experimental study of accumulation of copper macroparticles (MP) on a negatively biased substrate immersed in DC vacuum arc plasma. The influence of normal and tangential magnetic fields and high-frequency short-pulsed negative bias was investigated. The joint application of a tangential magnetic field and high frequency short-pulsed negative bias provides an effect of MP multifold suppression. With a tangential magnetic field strength of 175 Gs and repetitively pulsed bias (7 μs, 105 p.p.s., − 2 kV), total suppression efficiency is 250-fold after 6 min of ion-plasma treatment. For macroparticles with the diameter of less or > 1 μm, the efficiency is 3000-fold or 70-fold, respectively. In comparison with an axisymmetric vacuum-arc plasma source, the application of a steered arc ensures a 10-fold reduction in MP density on a substrate immersed in copper vacuum-arc plasma. The possibility of ion implantation using low-energy high-frequency short-pulse plasma immersion by implementing DC vacuum arc plasma is discussed.

Original languageEnglish
Pages (from-to)21-24
Number of pages4
JournalSurface and Coatings Technology
Volume306
DOIs
Publication statusPublished - 25 Nov 2016

Fingerprint

plasma jets
Copper
Cathodes
arcs
cathodes
Vacuum
Magnetic fields
Plasmas
copper
vacuum
Substrates
magnetic fields
direct current
retarding
Plasma sources
submerging
ion implantation
field strength
Ion implantation
Ions

Keywords

  • High-frequency short-pulse negative bias potential
  • Macroparticles
  • Steered arc
  • Vacuum-arc plasma

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

Cite this

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title = "Tangential cathode magnetic field and substrate bias influence on copper vacuum arc macroparticle content decreasing",
abstract = "The paper presents the results of an experimental study of accumulation of copper macroparticles (MP) on a negatively biased substrate immersed in DC vacuum arc plasma. The influence of normal and tangential magnetic fields and high-frequency short-pulsed negative bias was investigated. The joint application of a tangential magnetic field and high frequency short-pulsed negative bias provides an effect of MP multifold suppression. With a tangential magnetic field strength of 175 Gs and repetitively pulsed bias (7 μs, 105 p.p.s., − 2 kV), total suppression efficiency is 250-fold after 6 min of ion-plasma treatment. For macroparticles with the diameter of less or > 1 μm, the efficiency is 3000-fold or 70-fold, respectively. In comparison with an axisymmetric vacuum-arc plasma source, the application of a steered arc ensures a 10-fold reduction in MP density on a substrate immersed in copper vacuum-arc plasma. The possibility of ion implantation using low-energy high-frequency short-pulse plasma immersion by implementing DC vacuum arc plasma is discussed.",
keywords = "High-frequency short-pulse negative bias potential, Macroparticles, Steered arc, Vacuum-arc plasma",
author = "Stepanov, {Igor B.} and Ryabchikov, {Alexander I.} and Peter Semenovich Anan'in and Sivin, {Denis Olegovich} and Shevelev, {Alexey Eduardovich} and Zhelomsky, {Sergei G.}",
year = "2016",
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T1 - Tangential cathode magnetic field and substrate bias influence on copper vacuum arc macroparticle content decreasing

AU - Stepanov, Igor B.

AU - Ryabchikov, Alexander I.

AU - Anan'in, Peter Semenovich

AU - Sivin, Denis Olegovich

AU - Shevelev, Alexey Eduardovich

AU - Zhelomsky, Sergei G.

PY - 2016/11/25

Y1 - 2016/11/25

N2 - The paper presents the results of an experimental study of accumulation of copper macroparticles (MP) on a negatively biased substrate immersed in DC vacuum arc plasma. The influence of normal and tangential magnetic fields and high-frequency short-pulsed negative bias was investigated. The joint application of a tangential magnetic field and high frequency short-pulsed negative bias provides an effect of MP multifold suppression. With a tangential magnetic field strength of 175 Gs and repetitively pulsed bias (7 μs, 105 p.p.s., − 2 kV), total suppression efficiency is 250-fold after 6 min of ion-plasma treatment. For macroparticles with the diameter of less or > 1 μm, the efficiency is 3000-fold or 70-fold, respectively. In comparison with an axisymmetric vacuum-arc plasma source, the application of a steered arc ensures a 10-fold reduction in MP density on a substrate immersed in copper vacuum-arc plasma. The possibility of ion implantation using low-energy high-frequency short-pulse plasma immersion by implementing DC vacuum arc plasma is discussed.

AB - The paper presents the results of an experimental study of accumulation of copper macroparticles (MP) on a negatively biased substrate immersed in DC vacuum arc plasma. The influence of normal and tangential magnetic fields and high-frequency short-pulsed negative bias was investigated. The joint application of a tangential magnetic field and high frequency short-pulsed negative bias provides an effect of MP multifold suppression. With a tangential magnetic field strength of 175 Gs and repetitively pulsed bias (7 μs, 105 p.p.s., − 2 kV), total suppression efficiency is 250-fold after 6 min of ion-plasma treatment. For macroparticles with the diameter of less or > 1 μm, the efficiency is 3000-fold or 70-fold, respectively. In comparison with an axisymmetric vacuum-arc plasma source, the application of a steered arc ensures a 10-fold reduction in MP density on a substrate immersed in copper vacuum-arc plasma. The possibility of ion implantation using low-energy high-frequency short-pulse plasma immersion by implementing DC vacuum arc plasma is discussed.

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