Abstract
The paper presents the results of an experimental study of accumulation of copper macroparticles (MP) on a negatively biased substrate immersed in DC vacuum arc plasma. The influence of normal and tangential magnetic fields and high-frequency short-pulsed negative bias was investigated. The joint application of a tangential magnetic field and high frequency short-pulsed negative bias provides an effect of MP multifold suppression. With a tangential magnetic field strength of 175 Gs and repetitively pulsed bias (7 μs, 105 p.p.s., − 2 kV), total suppression efficiency is 250-fold after 6 min of ion-plasma treatment. For macroparticles with the diameter of less or > 1 μm, the efficiency is 3000-fold or 70-fold, respectively. In comparison with an axisymmetric vacuum-arc plasma source, the application of a steered arc ensures a 10-fold reduction in MP density on a substrate immersed in copper vacuum-arc plasma. The possibility of ion implantation using low-energy high-frequency short-pulse plasma immersion by implementing DC vacuum arc plasma is discussed.
| Original language | English |
|---|---|
| Pages (from-to) | 21-24 |
| Number of pages | 4 |
| Journal | Surface and Coatings Technology |
| Volume | 306 |
| DOIs | |
| Publication status | Published - 25 Nov 2016 |
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Keywords
- High-frequency short-pulse negative bias potential
- Macroparticles
- Steered arc
- Vacuum-arc plasma
ASJC Scopus subject areas
- Chemistry(all)
- Condensed Matter Physics
- Surfaces and Interfaces
- Surfaces, Coatings and Films
- Materials Chemistry
Cite this
Tangential cathode magnetic field and substrate bias influence on copper vacuum arc macroparticle content decreasing. / Stepanov, Igor B.; Ryabchikov, Alexander I.; Anan'in, Peter Semenovich; Sivin, Denis Olegovich; Shevelev, Alexey Eduardovich; Zhelomsky, Sergei G.
In: Surface and Coatings Technology, Vol. 306, 25.11.2016, p. 21-24.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Tangential cathode magnetic field and substrate bias influence on copper vacuum arc macroparticle content decreasing
AU - Stepanov, Igor B.
AU - Ryabchikov, Alexander I.
AU - Anan'in, Peter Semenovich
AU - Sivin, Denis Olegovich
AU - Shevelev, Alexey Eduardovich
AU - Zhelomsky, Sergei G.
PY - 2016/11/25
Y1 - 2016/11/25
N2 - The paper presents the results of an experimental study of accumulation of copper macroparticles (MP) on a negatively biased substrate immersed in DC vacuum arc plasma. The influence of normal and tangential magnetic fields and high-frequency short-pulsed negative bias was investigated. The joint application of a tangential magnetic field and high frequency short-pulsed negative bias provides an effect of MP multifold suppression. With a tangential magnetic field strength of 175 Gs and repetitively pulsed bias (7 μs, 105 p.p.s., − 2 kV), total suppression efficiency is 250-fold after 6 min of ion-plasma treatment. For macroparticles with the diameter of less or > 1 μm, the efficiency is 3000-fold or 70-fold, respectively. In comparison with an axisymmetric vacuum-arc plasma source, the application of a steered arc ensures a 10-fold reduction in MP density on a substrate immersed in copper vacuum-arc plasma. The possibility of ion implantation using low-energy high-frequency short-pulse plasma immersion by implementing DC vacuum arc plasma is discussed.
AB - The paper presents the results of an experimental study of accumulation of copper macroparticles (MP) on a negatively biased substrate immersed in DC vacuum arc plasma. The influence of normal and tangential magnetic fields and high-frequency short-pulsed negative bias was investigated. The joint application of a tangential magnetic field and high frequency short-pulsed negative bias provides an effect of MP multifold suppression. With a tangential magnetic field strength of 175 Gs and repetitively pulsed bias (7 μs, 105 p.p.s., − 2 kV), total suppression efficiency is 250-fold after 6 min of ion-plasma treatment. For macroparticles with the diameter of less or > 1 μm, the efficiency is 3000-fold or 70-fold, respectively. In comparison with an axisymmetric vacuum-arc plasma source, the application of a steered arc ensures a 10-fold reduction in MP density on a substrate immersed in copper vacuum-arc plasma. The possibility of ion implantation using low-energy high-frequency short-pulse plasma immersion by implementing DC vacuum arc plasma is discussed.
KW - High-frequency short-pulse negative bias potential
KW - Macroparticles
KW - Steered arc
KW - Vacuum-arc plasma
UR - http://www.scopus.com/inward/record.url?scp=84963705970&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84963705970&partnerID=8YFLogxK
U2 - 10.1016/j.surfcoat.2016.04.003
DO - 10.1016/j.surfcoat.2016.04.003
M3 - Article
AN - SCOPUS:84963705970
VL - 306
SP - 21
EP - 24
JO - Surface and Coatings Technology
JF - Surface and Coatings Technology
SN - 0257-8972
ER -