Tangential cathode magnetic field and substrate bias influence on copper vacuum arc macroparticle content decreasing

Abstract

The paper presents the results of an experimental study of accumulation of copper macroparticles (MP) on a negatively biased substrate immersed in DC vacuum arc plasma. The influence of normal and tangential magnetic fields and high-frequency short-pulsed negative bias was investigated. The joint application of a tangential magnetic field and high frequency short-pulsed negative bias provides an effect of MP multifold suppression. With a tangential magnetic field strength of 175 Gs and repetitively pulsed bias (7 μs, 10⁵ p.p.s., − 2 kV), total suppression efficiency is 250-fold after 6 min of ion-plasma treatment. For macroparticles with the diameter of less or > 1 μm, the efficiency is 3000-fold or 70-fold, respectively. In comparison with an axisymmetric vacuum-arc plasma source, the application of a steered arc ensures a 10-fold reduction in MP density on a substrate immersed in copper vacuum-arc plasma. The possibility of ion implantation using low-energy high-frequency short-pulse plasma immersion by implementing DC vacuum arc plasma is discussed.

Original language	English
Pages (from-to)	21-24
Number of pages	4
Journal	Surface and Coatings Technology
Volume	306
DOIs	https://doi.org/10.1016/j.surfcoat.2016.04.003
Publication status	Published - 25 Nov 2016

Keywords

High-frequency short-pulse negative bias potential
Macroparticles
Steered arc
Vacuum-arc plasma

ASJC Scopus subject areas

Chemistry(all)
Condensed Matter Physics
Surfaces and Interfaces
Surfaces, Coatings and Films
Materials Chemistry

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10.1016/j.surfcoat.2016.04.003

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1 Participation in conference

International Conference on Surface Modification of Materials by Ion Beams
Nurken Erbolatovich Aktaev (Participant) & Igor Borisovich Stepanov (Participant)
23 Nov 2015 → 27 Nov 2015
Activity: Participating in or organising an event types › Participation in conference

Cite this

Tangential cathode magnetic field and substrate bias influence on copper vacuum arc macroparticle content decreasing. / Stepanov, Igor B.; Ryabchikov, Alexander I.; Anan'in, Peter Semenovich; Sivin, Denis Olegovich ; Shevelev, Alexey Eduardovich; Zhelomsky, Sergei G.

In: Surface and Coatings Technology, Vol. 306, 25.11.2016, p. 21-24.

Research output: Contribution to journal › Article › peer-review

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title = "Tangential cathode magnetic field and substrate bias influence on copper vacuum arc macroparticle content decreasing",

abstract = "The paper presents the results of an experimental study of accumulation of copper macroparticles (MP) on a negatively biased substrate immersed in DC vacuum arc plasma. The influence of normal and tangential magnetic fields and high-frequency short-pulsed negative bias was investigated. The joint application of a tangential magnetic field and high frequency short-pulsed negative bias provides an effect of MP multifold suppression. With a tangential magnetic field strength of 175 Gs and repetitively pulsed bias (7 μs, 105 p.p.s., − 2 kV), total suppression efficiency is 250-fold after 6 min of ion-plasma treatment. For macroparticles with the diameter of less or > 1 μm, the efficiency is 3000-fold or 70-fold, respectively. In comparison with an axisymmetric vacuum-arc plasma source, the application of a steered arc ensures a 10-fold reduction in MP density on a substrate immersed in copper vacuum-arc plasma. The possibility of ion implantation using low-energy high-frequency short-pulse plasma immersion by implementing DC vacuum arc plasma is discussed.",

keywords = "High-frequency short-pulse negative bias potential, Macroparticles, Steered arc, Vacuum-arc plasma",

author = "Stepanov, {Igor B.} and Ryabchikov, {Alexander I.} and Peter Semenovich Anan'in and Sivin, {Denis Olegovich} and Shevelev, {Alexey Eduardovich} and Zhelomsky, {Sergei G.}",

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AU - Stepanov, Igor B.

AU - Ryabchikov, Alexander I.

AU - Anan'in, Peter Semenovich

AU - Sivin, Denis Olegovich

AU - Shevelev, Alexey Eduardovich

AU - Zhelomsky, Sergei G.

PY - 2016/11/25

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N2 - The paper presents the results of an experimental study of accumulation of copper macroparticles (MP) on a negatively biased substrate immersed in DC vacuum arc plasma. The influence of normal and tangential magnetic fields and high-frequency short-pulsed negative bias was investigated. The joint application of a tangential magnetic field and high frequency short-pulsed negative bias provides an effect of MP multifold suppression. With a tangential magnetic field strength of 175 Gs and repetitively pulsed bias (7 μs, 105 p.p.s., − 2 kV), total suppression efficiency is 250-fold after 6 min of ion-plasma treatment. For macroparticles with the diameter of less or > 1 μm, the efficiency is 3000-fold or 70-fold, respectively. In comparison with an axisymmetric vacuum-arc plasma source, the application of a steered arc ensures a 10-fold reduction in MP density on a substrate immersed in copper vacuum-arc plasma. The possibility of ion implantation using low-energy high-frequency short-pulse plasma immersion by implementing DC vacuum arc plasma is discussed.

AB - The paper presents the results of an experimental study of accumulation of copper macroparticles (MP) on a negatively biased substrate immersed in DC vacuum arc plasma. The influence of normal and tangential magnetic fields and high-frequency short-pulsed negative bias was investigated. The joint application of a tangential magnetic field and high frequency short-pulsed negative bias provides an effect of MP multifold suppression. With a tangential magnetic field strength of 175 Gs and repetitively pulsed bias (7 μs, 105 p.p.s., − 2 kV), total suppression efficiency is 250-fold after 6 min of ion-plasma treatment. For macroparticles with the diameter of less or > 1 μm, the efficiency is 3000-fold or 70-fold, respectively. In comparison with an axisymmetric vacuum-arc plasma source, the application of a steered arc ensures a 10-fold reduction in MP density on a substrate immersed in copper vacuum-arc plasma. The possibility of ion implantation using low-energy high-frequency short-pulse plasma immersion by implementing DC vacuum arc plasma is discussed.

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